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TXS0206-29YFPRB

更新时间： 2024-11-23 13:02:55
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德州仪器 - TI 稳压器LTE
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TXS0206-29YFPRB 数据手册

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TXS0206-29  
www.ti.com  
SCES690 –DECEMBER 2009  
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO  
VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING  
1
FEATURES  
•
Level Translator  
•
•
ESD Protection Exceeds JESD 22 (A Port)  
–
–
VCCA Range of 1.1 V to 3.6 V  
–
–
2000-V Human-Body Model (A114-B)  
1000-V Charged-Device Model (C101)  
Fast Propagation Delay (4 ns Max When  
Translating Between 1.8 V and 2.9 V)  
±8-kV Contact Discharge IEC 61000-4-2 ESD  
(B Port)  
•
Low-Dropout (LDO) Regulator  
–
–
–
–
200-mA LDO Regulator With Enable  
2.9-V Output Voltage  
3.05-V to 5.5-V Input Voltage Range  
Very Low Dropout: 200 mV at 200 mA  
YFP PACKAGE  
(TOP VIEW)  
TERMINAL ASSIGNMENTS  
1
2
3
4
1 2  
3
4
A
B
C
D
E
DAT2A  
DAT3A  
CMDA  
DAT0A  
DAT1A  
VCCA  
VBATT  
GND  
CLKA  
CLK-f  
WP/CD  
VCCB O/P  
GND  
DAT2B  
DAT3B  
CMDB  
DAT0B  
DAT1B  
A
B
C
D
E
CLKB  
EN  
DESCRIPTION/ORDERING INFORMATION  
The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure  
digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout  
(LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.  
The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to  
3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from  
3.05V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The  
TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards  
operating at 2.9 V.  
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory  
card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.  
Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players,  
camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an  
ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP).  
This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings  
ORDERING INFORMATION(1)  
TA  
–40°C to 85°C WCSP – YFP (Pb-free)  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
Tape and reel  
TXS0206-29YFPR  
_ _ _ 3 V 2  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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TXS0206-29YFPRB 替代型号

型号 品牌 替代类型 描述 数据表
TXS0206YFPR TI

完全替代

 MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATI
TXS0206-29YFPR TI

完全替代

 MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATI

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