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TXS02612_10

更新时间： 2024-11-09 06:02:39
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德州仪器 - TI /
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24页 600K
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SDIO PORT EXANDER WITH VOLTAGE-LEVEL TRANSLATION

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TXS02612_10 数据手册

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TXS02612  
www.ti.com  
SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009  
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION  
1
FEATURES  
•
6-to-12 Demultiplexer/Multiplexer Allows SDIO  
Port Expansion  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
Built-in Level Translator Eliminates Voltage  
Mismatch Between Baseband and SD Card or  
SDIO Peripheral  
ESD Performance A Port  
–
–
–
2000-V Human-Body Model (A114-B)  
100-V Machine Model (A115-A)  
•
VCCA, VCCB0, and VCCB1 Each Operate Over Full  
1.1-V to 3.6-V Range  
1500-V Charged-Device Model (C101)  
•
±8-kV Contact Discharge IEC 61000-4-2 ESD  
Performance (B Port)  
DESCRIPTION/ORDERING INFORMATION  
The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device  
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be  
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full  
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if  
required.  
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is  
selected; when SEL = High, B1 port is selected. SEL is referenced to VCCA. For the unselected B port, the clock  
output is held low, whereas the data and command I/Os are pulled high to their respective VCCB through a 70-kΩ  
resistor (±30% tolerance).  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
YJ612  
YJ612  
MicroStar Junior™ BGA  
Reel of 3000  
Reel of 3000  
TXS02612ZQSR  
(VFBGA) – ZQS  
QFN – RTW  
–40°C to 85°C  
TXS02612RTWR  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
RTW PACKAGE  
(TOP VIEW)  
Table 1. ZQS PACKAGE TERMINAL  
ZQS PACKAGE  
(TOP VIEW)  
ASSIGNMENTS  
1
2
3
4
5
1
3
2 4 5  
A
B
C
D
E
DAT2A  
DAT3A  
CMDA  
DAT0A  
DAT1A  
SEL  
DAT3B0  
DAT2B0  
GND  
CMDB0  
VCCB0  
VCC B1  
DAT1B1  
CMDB1  
CLKB0  
DAT0B0  
DAT1B0  
DAT0B1  
CLKB1  
A
B
C
D
E
24 23 22 21 20 19  
DAT2A  
GND  
1
2
3
4
5
6
18 DAT0  
17 VCC  
B0  
VCCA  
CLKA  
B1  
Exposed  
Center Pad  
DAT3A  
CMDA  
16 DAT1  
15 DAT1  
14 DAT0  
13 CLK  
GND  
B0  
B1  
B1  
DAT2B1  
DAT3B1  
V
CCA  
DAT0A  
For RTW, if the exposed  
center pad is used, it must  
be connected to ground  
or electrically open.  
B1  
7
8
9 10 11 12  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008–2009, Texas Instruments Incorporated  
1234567...24

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