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TSPC106AMGB/Q66CE PDF预览

TSPC106AMGB/Q66CE

更新时间: 2024-11-19 23:38:15
品牌 Logo 应用领域
其他 - ETC 存储外围集成电路控制器PC时钟
页数 文件大小 规格书
40页 540K
描述
MEMORY CONTROLLER

TSPC106AMGB/Q66CE 数据手册

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Features  
Processor Bus Frequency Up to 66 MHz and 83.3 MHz  
64-bit Data Bus and 32-bit Address Bus  
L2 Cache Control for 256-Kbyte, 512-Kbyte, 1-Mbyte Sizes  
Provides Support for Either Asynchronous SRAM, Burst SRAM  
or Pipelined Burst SRAM  
Compliant with PCI Specification, Revision 2.1  
PCI Interface Operates at 20 to 33 MHz, 3.3V/5.0V-compatible  
IEEE 1149.1-compliant, JTAG Boundary-scan Interface  
PD Max = 1.7 Watts (66 MHz), Full Operating Conditions  
Nap, Doze and Sleep Modes Reduce Power Consumption  
Fully Compliant with MIL-STD-883 Class Q or According to Atmel Standards  
Upscreenings Based on Atmel Standards  
Full Military Temperature Range (-55°C TC +125°C)  
– Industrial Temperature Range (-40°C TC +110°C)  
VCC = 3.3V 5%  
PCI Bridge/  
Memory  
Controller  
Available in a 303-ball CBGA or a 303-ball CBGA with Solder Column Interposer (SCI)  
(CI-CGA) Package  
TSPC106  
Description  
The TSPC106 provides an integrated, high-bandwidth, high-performance, TTL-com-  
patible interface between a 60x processor, a secondary (L2) cache or up to a total of  
four additional 60x processors, the PCI bus and main memory.  
PCI support allows system designers to rapidly design systems using peripherals  
already designed for PCI.  
The TSPC106 uses an advanced 3.3V CMOS-process technology and maintains full  
interface compatibility with TTL devices.  
The TSPC106 integrates system testability and debugging features via JTAG bound-  
ary-scan capability.  
GS suffix  
CI CGA 303  
G suffix  
CBGA 303  
Ceramic Ball Grid Array  
Ceramic Ball Grid Array  
with Solder Column Interposer (SCI)  
Rev. 2102BHIREL02/02  

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