Datasheet > TSPC106AMGS66CE

TSPC106AMGS66CE

更新时间： 2024-11-17 23:38:15

品牌	Logo	应用领域
其他 - ETC		存储外围集成电路控制器异步传输模式 PC ATM 时钟
页数	文件大小	规格书
40页	540K
描述
MEMORY CONTROLLER

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中文翻译

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数据手册

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TSPC106AMGS66CE 数据手册

Features

• Processor Bus Frequency Up to 66 MHz and 83.3 MHz

• 64-bit Data Bus and 32-bit Address Bus

• L2 Cache Control for 256-Kbyte, 512-Kbyte, 1-Mbyte Sizes

• Provides Support for Either Asynchronous SRAM, Burst SRAM

or Pipelined Burst SRAM

• Compliant with PCI Specification, Revision 2.1

• PCI Interface Operates at 20 to 33 MHz, 3.3V/5.0V-compatible

• IEEE 1149.1-compliant, JTAG Boundary-scan Interface

• P_DMax = 1.7 Watts (66 MHz), Full Operating Conditions

• Nap, Doze and Sleep Modes Reduce Power Consumption

• Fully Compliant with MIL-STD-883 Class Q or According to Atmel Standards

• Upscreenings Based on Atmel Standards

• Full Military Temperature Range (-55°C ≤ T_C≤ +125°C)

– Industrial Temperature Range (-40°C ≤ T_C≤ +110°C)

• V_CC= 3.3V 5%

PCI Bridge/

Memory

Controller

• Available in a 303-ball CBGA or a 303-ball CBGA with Solder Column Interposer (SCI)

(CI-CGA) Package

TSPC106

Description

The TSPC106 provides an integrated, high-bandwidth, high-performance, TTL-com-

patible interface between a 60x processor, a secondary (L2) cache or up to a total of

four additional 60x processors, the PCI bus and main memory.

PCI support allows system designers to rapidly design systems using peripherals

already designed for PCI.

The TSPC106 uses an advanced 3.3V CMOS-process technology and maintains full

interface compatibility with TTL devices.

The TSPC106 integrates system testability and debugging features via JTAG bound-

ary-scan capability.

GS suffix

CI CGA 303

G suffix

CBGA 303

Ceramic Ball Grid Array

with Solder Column Interposer (SCI)

Rev. 2102B–HIREL–02/02

12 3 4 5 6 7...40

中文翻译

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