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TSM3442CX6RFG PDF预览

TSM3442CX6RFG

更新时间: 2024-10-15 01:19:03
品牌 Logo 应用领域
TSC /
页数 文件大小 规格书
7页 224K
描述
N-Channel Power MOSFET

TSM3442CX6RFG 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

TSM3442CX6RFG 数据手册

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TSM3442  
Taiwan Semiconductor  
N-Channel Power MOSFET  
20V, 4A, 70m  
FEATURES  
KEY PERFORMANCE PARAMETERS  
Advance Trench Process Technology  
PARAMETER  
VALUE  
UNIT  
High Density Cell Design for Ultra Low On-resistance  
VDS  
20  
70  
90  
5.4  
V
VGS = 4.5V  
VGS = 2.5V  
APPLICATION  
RDS(on) (max)  
m  
Load Switch  
Qg  
nC  
PA Switch  
SOT-26  
Notes: Moisture sensitivity level: level 3. Per J-STD-020  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
20  
V
V
VGS  
±8  
TC = 25°C  
4
Continuous Drain Current (Note 1)  
ID  
A
TC = 100°C  
2.4  
8
Pulsed Drain Current (Note 2)  
IDM  
A
Total Power Dissipation @ TC = 25°C  
PDTOT  
1.25  
W
°C  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
- 55 to +150  
THERMAL PERFORMANCE  
PARAMETER  
SYMBOL  
RӨJC  
LIMIT  
30  
UNIT  
°C/W  
°C/W  
Junction to Case Thermal Resistance  
Junction to Ambient Thermal Resistance  
RӨJA  
80  
Notes: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined  
at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board  
design. RӨJA shown below for single device operation on FR-4 PCB in still air  
,
Document Number: DS_P0000076  
1
Version: B15  

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