Datasheet > TS3DDR4000

TS3DDR4000

更新时间： 2023-09-03 20:28:35

品牌	Logo	应用领域
德州仪器 - TI		开关双倍数据速率光电二极管
页数	文件大小	规格书
24页	1050K
描述
3.3V、2:1 (SPDT)、12 通道 DDR2、DDR3 和 DDR4 开关

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TS3DDR4000 数据手册

TS3DDR4000

ZHCSDL6C –NOVEMBER 2014–REVISED MARCH 2019

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

-0.3

-40

MAX

4.8

UNIT

V_DD

V_IN

V_I/O

T_A

Voltage range on V_DD

Control input voltage range: SEL0, SEL1, and /EN

Analog voltage range: A0-A11, B0-B11, and C0-C11

Operating ambient temperature range

Storage temperature range

5.5

3.6

°C

T_stg

-65

125

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT

Charge device model (CDM)⁽¹⁾

Human body model (HBM) on all pins⁽²⁾

±1000

±3000

Electrostatic

discharge

V_(ESD)

(1) Tested in accordance with JEDEC Standard 22, Test Method C101

(2) Tested in accordance with JEDEC Standard 22, Test Method A114

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

2.375

MAX

UNIT

V_DDVoltage range on V_DD

3.6

3.3

V_DD

0.5

V_I/O

Analog voltage range: A0-A11, B0-B11, and C0-C11

High-level control input voltage threshold (EN)

1.4

V_IH

High-level control input voltage threshold (SEL0 and SEL1)

Low-level control input voltage threshold (EN, SEL0 and SEL1)

Operating ambient temperature range

V_IL

T_A

-40

°C

6.4 Thermal Information

TS3DDR4000

BGA (48)

92.6

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

R_θJC(top)

R_θJB

ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

33.4

56.2

°C/W

Junction-to-top characterization parameter

Junction-to-board characterization parameter

1.3

ψ_JB

54.9

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report .

1 2 345 6 7...24

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