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TS3DS26227_14

更新时间： 2024-11-22 02:58:43
品牌 Logo 应用领域
德州仪器 - TI 输入元件光电二极管
页数 文件大小 规格书
19页 510K
描述
HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION

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TS3DS26227  
HIGH-BANDWIDTH DUAL-SPDT DIFFERENTIAL SIGNAL SWITCH  
WITH INPUT LOGIC TRANSLATION  
www.ti.com  
SCDS234–SEPTEMBER 2006  
FEATURES  
APPLICATIONS  
•
•
•
•
Cell Phones  
PDAs  
Portable Instrumentation  
Low-Voltage Differential Signal Routing  
•
•
•
•
•
•
•
•
•
High-Bandwidth Data Paths – Up to 800 MHz  
Specified Break-Before-Make Switching  
Control Inputs Reference to VIO  
Low Charge Injection  
Excellent ON-State Resistance Matching  
Low Total Harmonic Distortion (THD)  
2.3-V to 3.6-V Power Supply (V+)  
1.65-V to 1.95-V Logic Supply (VIO)  
YZT PACKAGE  
(BOTTOM THROUGH VIEW)  
A
B
C
D
3
2
1
4
5
6
9
8
7
10  
11  
12  
1
2
3
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Performance Tested Per JESD 22  
A
B
C
D
– 4000-V Human-Body Model  
(A114-B, Class II)  
1
2
3
IN1  
NO1 COM1 NC1  
GND GND  
NO2 COM2 NC2  
V
V
IO  
IN2  
+
– 1000-V Charged-Device Model (C101)  
– 200-V Machine Model (A115-A)  
DESCRIPTION/ORDERING INFORMATION  
The TS3DS26227 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from  
2.3 V to 3.6 V. The device offers high-bandwidth data paths, and a break-before-make feature to prevent signal  
distortion during the transferring of a signal from one path to another. The device has excellent total harmonic  
distortion (THD) performance and consumes very low power. These features make this device suitable for  
portable applications.  
The TS3DS26227 has a separate logic supply pin (VIO) that operates from 1.65 V to 1.95 V. VIO powers the  
control circuitry, which allows the TS3DS26227 to be controlled by 1.8-V signals.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
267  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZT (Pb-free)  
0625-mm max height  
–40°C to 85°C  
Tape and reel  
TS3DS26227YZTR  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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