Datasheet > TS3DDR4000

TS3DDR4000

更新时间： 2023-09-03 20:28:35

品牌	Logo	应用领域
德州仪器 - TI		开关双倍数据速率光电二极管
页数	文件大小	规格书
24页	1050K
描述
3.3V、2:1 (SPDT)、12 通道 DDR2、DDR3 和 DDR4 开关

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

TS3DDR4000 数据手册

TS3DDR4000

ZHCSDL6C –NOVEMBER 2014–REVISED MARCH 2019

www.ti.com.cn

8.3 Feature Description................................................. 12

8.4 Device Functional Modes........................................ 12

Application and Implementation ........................ 13

9.1 Application Information............................................ 13

9.2 Typical Application ................................................. 13

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Static Electrical Characteristics................................. 5

6.6 Dynamic Electrical Characteristics............................ 6

6.7 Typical Characteristics.............................................. 7

Parameter Measurement Information .................. 9

Detailed Description ............................................ 11

8.1 Overview ................................................................. 11

8.2 Functional Block Diagram ....................................... 11

10 Power Supply Recommendations ..................... 14

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Example .................................................... 16

12 器件和文档支持 ..................................................... 17

12.1 接收文档更新通知 ................................................. 17

12.2 社区资源................................................................ 17

12.3 商标....................................................................... 17

12.4 静电放电警告......................................................... 17

12.5 术语表 ................................................................... 17

13 机械、封装和可订购信息....................................... 17

4 修订历史记录

Changes from Revision B (May 2017) to Revision C

Page

•

Changed the Pin Configuration image.................................................................................................................................... 3

Changed V_IHFrom: SEL1m and SEL2 To: SEL0 and SEL1 with a MIN value of 1 V in the Recommended Operating

Conditions............................................................................................................................................................................... 4

•

Changed SEL1 To: SEL0 and SLE2 To: SEL1 in 图 18 ...................................................................................................... 11

Changed text 'Standard layout technique for 0.5 mm pitch BGA package" To: "Standard layout technique for 0.65

mm pitch BGA package..." in the Layout Guidelines............................................................................................................ 15

Changes from Revision A (March 2015) to Revision B

Page

•

Changed V_DDMax value From: 5.5 V toTo: 4.8 V in the Absolute Maximum Ratings........................................................... 4

Added the Note to the Application and Implementation section........................................................................................... 13

Changes from Original (November 2014) to Revision A

Page

•

已将文档更新为完整版。 ........................................................................................................................................................ 1

123 4 5 6 7...24

中文翻译

下载PDF

与TS3DDR4000相关器件

型号	品牌	获取价格	描述	数据表
TS3DDR4000ZBAR	TI	获取价格	3.3V、2:1 (SPDT)、12 通道 DDR2、DDR3 和 DDR4 开关 \| Z
TS3DS10224	TI	获取价格	High-Speed 2:4 Differential Multiplexer / Demultiplexer
TS3DS10224RUKR	TI	获取价格	High-Speed 2:4 Differential Multiplexer / Demultiplexer
TS3DS26227	TI	获取价格	HIGH-BANDWIDTH DUAL-SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION
TS3DS26227_10	TI	获取价格	HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION
TS3DS26227_14	TI	获取价格	HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION
TS3DS26227YZPR	TI	获取价格	HIGH-BANDWIDTH DUAL SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION
TS3DS26227YZTR	TI	获取价格	HIGH-BANDWIDTH DUAL-SPDT DIFFERENTIAL SIGNAL SWITCH WITH INPUT LOGIC TRANSLATION
TS3DV20812	TI	获取价格	2-Gbps DIFFRETIAL SWITCH 8-bit, 1:2 MULTIPLEXER/DEMULTIPEXER WITH 3-SIDE BAND SIGNALS
TS3DV20812_1	TI	获取价格	2-Gbps DIFFERENTIAL SWITCH 8-Bit, 1:2 MULTIPLEXER/DEMULTIPLEXER WITH 3-SIDE BAND SIGNALS

与TS3DDR4000相关文章

压敏电阻器在直流电路中的过压保护应用探讨
2024-06-07

2
电感耐压值及其与电感大小的关系
2024-06-07

5
CNY17F光耦合器：特性、应用、封装、引脚功能及替换型号解析
2024-06-07

4
DS1307资料解析：特性、引脚说明、替代推荐
2024-06-07

3

产品中心

服务支持

精选活动

关于我们

帮助中心

TS3DDR4000

TS3DDR4000 数据手册

与TS3DDR4000相关器件

与TS3DDR4000相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TS3DDR4000

TS3DDR4000 数据手册

与TS3DDR4000相关器件

与TS3DDR4000相关文章

您还可以找

您在本页遇到什么问题？