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TQ8223

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TQ8223 数据手册

TQS Reliability Report # 00-08

TQ8223

Device Qualification

Abstract

This report summarizes the reliability testing that has been performed to qualify the TQ8223

product. The SC5068 is a Superset of the TQ8223 and was previously qualified. The TQ8213,

which is also packaged in a 208 BGA, was used as an additional lot for dimensional qualification.

TQ8223 and SC5068

Both of these parts are fabricated on TriQuint's 0.6mm E/D MESFET GaAs process and are

packaged in a 208 BGA package. Tests, test sample size and failure criteria were defined from

TriQuint’s Specification REL.021 (Policy and Procedure for Reliability Qualifications of ICs). Tests

outlined in this procedure follow the JEDEC Standard Number 26-A or MIL-STD-883 when

applicable.

For further information please contact:

TriQuint Semiconductor

2300 N.E. Brookwood Parkway

Hillsboro, OR 97124

Phone: (503) 615-9000

FAX: (503) 615-8900

Reliability Test Report

08/01/00

12 3 4 5

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