TPS22906
www.ti.com................................................................................................................................................................................................... SLVS921–MARCH 2009
ULTRA-SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH
1
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
Personal Digital Assistants (PDAs)
Cellular Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Portable Instrumentation
RF Modules
•
Low Input Voltage: 1.0 V to 3.6 V
•
Ultra-Low ON-State Resistance
–
–
–
–
rON = 90 mΩ at VIN = 3.6 V
rON = 100 mΩ at VIN = 2.5 V
rON = 114 mΩ at VIN = 1.8 V
rON = 172 mΩ at VIN = 1.2 V
•
•
•
•
500-mA Maximum Continuous Switch Current
Ultra Low Quiescent Current: 82 nA at 1.8 V
Ultra Low Shutdown Current: 44 nA at 1.8 V
DESCRIPTION
Low Control Input Thresholds Enable Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
TPS22906 is an ultra-small, low ON-state resistance
(rON) load switch with controlled turn on. The device
contains a P-channel MOSFET that operates over an
input voltage range of 1.0 V to 3.6 V. The switch is
controlled by an on/off input (ON), which is capable of
interfacing directly with low-voltage control signals. A
120-Ω on-chip load resistor is added for output quick
discharge when the switch is turned off.
•
•
Controlled Slew Rate to Avoid Inrush Current:
220 µs tr
ESD Performance Tested Per JESD 22
–
2000-V Human-Body Model
(A114-B, Class II)
–
1000-V Charged-Device Model (C101)
TPS22906 is available in a space-saving 4-terminal
WCSP with 0.5-mm pitch (YZV). The device is
characterized for operation over the free-air
temperature range of –40°C to 85°C.
•
Four-Terminal Wafer-Chip-Scale Package
(WCSP)
–
0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
YZV PACKAGE
TERMINAL ASSIGNMENTS
B
A
B
A
B
A
ON
VIN
2
GND
VOUT
1
2
1
1
2
Laser Marking View Bump View
QUICK
OUTPUT
rON at 1.8 V
SLEW RATE
(TYP at 1.8 V)
MAX OUTPUT
CURRENT
DEVICE
(TYP)
ENABLE
DISCHARGE(1)
TPS22906
114 mΩ
220 µs
Yes
500 mA
Active high
(1) This feature discharges the output of the switch to ground through a 120-Ω resistor, preventing the
output from floating.
ORDERING INFORMATION
TA
–40°C to 85°C WCSP – YZV (0.5-mm pitch)
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
_ _ _ 5D_(3)
Tape and reel
TPS22906YZVR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.