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TPS22906 PDF预览

TPS22906

更新时间: 2024-11-11 05:52:19
品牌 Logo 应用领域
德州仪器 - TI 开关输入元件
页数 文件大小 规格书
18页 470K
描述
ULTRA-SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH

TPS22906 数据手册

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TPS22906  
www.ti.com................................................................................................................................................................................................... SLVS921MARCH 2009  
ULTRA-SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH  
1
FEATURES  
APPLICATIONS  
Personal Digital Assistants (PDAs)  
Cellular Phones  
GPS Devices  
MP3 Players  
Digital Cameras  
Peripheral Ports  
Portable Instrumentation  
RF Modules  
Low Input Voltage: 1.0 V to 3.6 V  
Ultra-Low ON-State Resistance  
rON = 90 mat VIN = 3.6 V  
rON = 100 mat VIN = 2.5 V  
rON = 114 mat VIN = 1.8 V  
rON = 172 mat VIN = 1.2 V  
500-mA Maximum Continuous Switch Current  
Ultra Low Quiescent Current: 82 nA at 1.8 V  
Ultra Low Shutdown Current: 44 nA at 1.8 V  
DESCRIPTION  
Low Control Input Thresholds Enable Use of  
1.2-V/1.8-V/2.5-V/3.3-V Logic  
TPS22906 is an ultra-small, low ON-state resistance  
(rON) load switch with controlled turn on. The device  
contains a P-channel MOSFET that operates over an  
input voltage range of 1.0 V to 3.6 V. The switch is  
controlled by an on/off input (ON), which is capable of  
interfacing directly with low-voltage control signals. A  
120-on-chip load resistor is added for output quick  
discharge when the switch is turned off.  
Controlled Slew Rate to Avoid Inrush Current:  
220 µs tr  
ESD Performance Tested Per JESD 22  
2000-V Human-Body Model  
(A114-B, Class II)  
1000-V Charged-Device Model (C101)  
TPS22906 is available in a space-saving 4-terminal  
WCSP with 0.5-mm pitch (YZV). The device is  
characterized for operation over the free-air  
temperature range of –40°C to 85°C.  
Four-Terminal Wafer-Chip-Scale Package  
(WCSP)  
0.9 mm × 0.9 mm,  
0.5-mm Pitch, 0.5-mm Height  
YZV PACKAGE  
TERMINAL ASSIGNMENTS  
B
A
B
A
B
A
ON  
VIN  
2
GND  
VOUT  
1
2
1
1
2
Laser Marking View Bump View  
QUICK  
OUTPUT  
rON at 1.8 V  
SLEW RATE  
(TYP at 1.8 V)  
MAX OUTPUT  
CURRENT  
DEVICE  
(TYP)  
ENABLE  
DISCHARGE(1)  
TPS22906  
114 m  
220 µs  
Yes  
500 mA  
Active high  
(1) This feature discharges the output of the switch to ground through a 120-resistor, preventing the  
output from floating.  
ORDERING INFORMATION  
TA  
–40°C to 85°C WCSP – YZV (0.5-mm pitch)  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
_ _ _ 5D_(3)  
Tape and reel  
TPS22906YZVR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to  
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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