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TPS22907_0912 PDF预览

TPS22907_0912

更新时间: 2024-09-28 05:52:19
品牌 Logo 应用领域
德州仪器 - TI 开关输入元件
页数 文件大小 规格书
14页 1780K
描述
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH

TPS22907_0912 数据手册

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TPS22907  
www.ti.com  
SLVSA44 NOVEMBER 2009  
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH  
Check for Samples: TPS22907  
1
FEATURES  
APPLICATIONS  
Battery Powered Equipment  
Portable Industrial Equipment  
Portable Medical Equipment  
Portable Media Players  
Point Of Sales Terminal  
GPS Devices  
Digital Cameras  
Portable Instrumentation  
Smartphones  
Low Input Voltage: 1.1 V to 3.6 V  
Ultra-Low ON-State Resistance  
rON = 44 mat VIN = 3.6 V  
rON = 50 mat VIN = 2.5 V  
rON = 58 mat VIN = 1.8 V  
rON = 83 mat VIN = 1.2 V  
1-A Maximum Continuous Switch Current  
Quiescent Current < 1 µA  
Shutdown Current < 1 µA  
YZT PACKAGE  
Low Control Input Thresholds Enable Use of  
Low-Voltage Logic  
B
A
B
A
Controlled Slew Rate to Avoid Inrush Currents  
ESD Performance Tested Per JESD 22  
2
1
1
2
3000-V Human-Body Model  
(A114-B, Class II)  
Laser Marking View Bump View  
1000-V Charged-Device Model (C101)  
Table 1. TERMINAL ASSIGNMENTS  
Ultra Small Four-Terminal Wafer Chip Scale  
Package (WCSP)  
B
A
ON  
VIN  
2
GND  
VOUT  
1
0.9 mm × 0.9 mm,  
0.5-mm Pitch, 0.5-mm Height  
DESCRIPTION  
The TPS22907 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel  
MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input  
(ON), which is capable of interfacing directly with low-voltage control signals.  
The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is  
characterized for operation over the free-air temperature range of –40°C to 85°C.  
rON  
SLEW RATE  
(TYP at 1.8 V)  
MAXIMUM OUTPUT  
CURRENT  
DEVICE  
ENABLE  
(TYP at 1.8 V)  
TPS22907  
58 m  
36 μs  
1000 mA  
Active high  
ORDERING INFORMATION  
TA  
–40°C to 85°C WCSP – YZT (0.5-mm pitch)  
PACKAGE(1) (2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
_ _ _ 5K_(3)  
Tape and reel  
TPS22907YZTR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to  
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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