TPS22907
www.ti.com
SLVSA44 –NOVEMBER 2009
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH
Check for Samples: TPS22907
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FEATURES
APPLICATIONS
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•
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Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones
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Low Input Voltage: 1.1 V to 3.6 V
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Ultra-Low ON-State Resistance
–
–
–
–
rON = 44 mΩ at VIN = 3.6 V
rON = 50 mΩ at VIN = 2.5 V
rON = 58 mΩ at VIN = 1.8 V
rON = 83 mΩ at VIN = 1.2 V
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1-A Maximum Continuous Switch Current
Quiescent Current < 1 µA
Shutdown Current < 1 µA
YZT PACKAGE
Low Control Input Thresholds Enable Use of
Low-Voltage Logic
B
A
B
A
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Controlled Slew Rate to Avoid Inrush Currents
ESD Performance Tested Per JESD 22
2
1
1
2
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3000-V Human-Body Model
(A114-B, Class II)
Laser Marking View Bump View
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1000-V Charged-Device Model (C101)
Table 1. TERMINAL ASSIGNMENTS
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Ultra Small Four-Terminal Wafer Chip Scale
Package (WCSP)
B
A
ON
VIN
2
GND
VOUT
1
–
0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
DESCRIPTION
The TPS22907 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel
MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input
(ON), which is capable of interfacing directly with low-voltage control signals.
The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is
characterized for operation over the free-air temperature range of –40°C to 85°C.
rON
SLEW RATE
(TYP at 1.8 V)
MAXIMUM OUTPUT
CURRENT
DEVICE
ENABLE
(TYP at 1.8 V)
TPS22907
58 mΩ
36 μs
1000 mA
Active high
ORDERING INFORMATION
TA
–40°C to 85°C WCSP – YZT (0.5-mm pitch)
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
_ _ _ 5K_(3)
Tape and reel
TPS22907YZTR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.