是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | BGA |
包装说明: | DSBGA-4 | 针数: | 4 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 7.01 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 280140 |
Samacsys Pin Count: | 4 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | BGA4C50P2X2_90X90X63 |
Samacsys Released Date: | 2017-01-12 12:59:53 | Is Samacsys: | N |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-XBGA-B4 | JESD-609代码: | e1 |
长度: | 0.9 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 4 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 0.625 mm |
最大供电电流 (Isup): | 0.001 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 1.1 V | 标称供电电压 (Vsup): | 1.2 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 0.9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS22907YZTR | TI |
功能相似 |
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH | |
TPS22906YZVR | TI |
功能相似 |
ULTRA-SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH |
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