TPS22903
www.ti.com ............................................................................................................................................................................................ SLVS827–FEBRUARY 2009
ULTRA-SMALL LOW-INPUT-VOLTAGE LOW rON LOAD SWITCH
1
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Portable Instrumentation
•
Input Voltage: 1.1 V to 3.6 V
•
Ultra-Low ON-State Resistance
–
–
–
–
rON = 66 mΩ at VIN = 3.6 V
rON = 75 mΩ at VIN = 2.5 V
rON = 90 mΩ at VIN = 1.8 V
rON = 135 mΩ at VIN = 1.2 V
•
•
•
•
500-mA Maximum Continuous Switch Current
Quiescent Current < 1 µA
YFP PACKAGE
Shutdown Current < 1 µA
B
A
B
A
Low Control Input Threshold Enables Use of
1.2-V/1.8-V/2.5-V/3.3-V Logic
2
1
1
2
•
•
Controlled Slew Rate (5 µs Max at 3.6 V)
Laser Marking View
Bump View
ESD Performance Tested Per JESD 22
–
2000-V Human-Body Model
(A114-B, Class II)
TERMINAL ASSIGNMENTS
B
A
GND
VOUT
2
ON
VIN
1
–
1000-V Charged-Device Model (C101)
•
4-Terminal Wafer Chip-Scale Package (WCSP)
–
0.8 mm × 0.8 mm,
0.4-mm Pitch, 0.5-mm Height
DESCRIPTION
TPS22903 is an ultra-small, low rON dual load switch with controlled turn on. The device contains a P-channel
MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off
input (ON), which is capable of interfacing directly with low-voltage control signals.
TPS22903 is available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The device is characterized for
operation over the free-air temperature range of –40°C to 85°C.
FEATURE LIST
MAXIMUM
OUTPUT
CURRENT
rON TYPICAL SLEW RATE QUICK OUTPUT
DEVICE
ENABLE
AT 3.6 V
AT 3.6 V
DISCHARGE(1)
TPS22903
69 mΩ
5 µs max
No
500 mA
Active high
(1) This feature discharges the output of the switch to ground through a 120-Ω resistor, preventing the
output from floating.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
_ _ _4P_
–40°C to 85°C
WCSP – YFP (0.4-mm pitch)
Tape and reel
TPS22903YFPR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.