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TPH1110ENH PDF预览

TPH1110ENH

更新时间: 2024-11-05 19:32:15
品牌 Logo 应用领域
东芝 - TOSHIBA 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 234K
描述
Power MOSFET - Nch 150V<VDSS≤250V

TPH1110ENH 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-F5
Reach Compliance Code:unknown风险等级:5.73
雪崩能效等级(Eas):33 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (ID):7.2 A最大漏源导通电阻:0.114 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-F5
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):25 A
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TPH1110ENH 数据手册

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TPH1110ENH  
MOSFETs Silicon N-channel MOS (U-MOS-H)  
TPH1110ENH  
1. Applications  
High-Efficiency DC-DC Converters  
Switching Voltage Regulators  
2. Features  
(1) High-speed switching  
(2) Small gate charge: QSW = 2.6 nC (typ.)  
(3) Low drain-source on-resistance: RDS(ON) = 96 m(typ.) (VGS = 10 V)  
(4) Low leakage current: IDSS = 10 µA (max) (VDS = 200 V)  
(5) Enhancement mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 0.2 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
SOP Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
200  
±20  
13  
(Silicon limit)  
(Continuous)  
(t = 1 ms)  
(Note 1), (Note 2)  
(Note 1)  
A
ID  
7.2  
(Note 1)  
IDP  
PD  
25  
(Tc = 25 )  
(t = 10 s)  
42  
W
(Note 3)  
(Note 4)  
(Note 5)  
PD  
2.8  
(t = 10 s)  
PD  
1.6  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
Tch  
Tstg  
33  
mJ  
A
7.2  
Channel temperature  
Storage temperature  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2013-10-22  
Rev.1.0  
1

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