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TPCA8123,L1Q(O PDF预览

TPCA8123,L1Q(O

更新时间: 2024-11-25 19:25:03
品牌 Logo 应用领域
东芝 - TOSHIBA 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 245K
描述
Power Field-Effect Transistor, 50A I(D), 60V, 0.0149ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET

TPCA8123,L1Q(O 技术参数

生命周期:Not Recommended包装说明:SMALL OUTLINE, S-PDSO-F5
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.69雪崩能效等级(Eas):206 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (ID):50 A
最大漏源导通电阻:0.0149 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-F5元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):150 A表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TPCA8123,L1Q(O 数据手册

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TPCA8123  
MOSFETs Silicon P-Channel MOS (U-MOS)  
TPCA8123  
1. Applications  
Motor Drivers  
Switching Voltage Regulators  
2. Features  
(1) Small, thin package  
(2) Low drain-source on-resistance: RDS(ON) = 8.5 m(typ.) (VGS = -10 V)  
(3) Low leakage current: IDSS = -10 µA (max) (VDS = -60 V)  
(4) Enhancement mode: Vth = -2.0 to -3.0 V (VDS = -10 V, ID = -1.0 mA)  
3. Packaging and Internal Circuit  
1,2,3: Source  
4: Gate  
5, 6, 7, 8: Drain  
SOP Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
-60  
-20/+10  
-50  
(Note 1)  
(Note 1)  
A
IDP  
-150  
84  
(Tc = 25)  
(t = 10 s)  
(t = 10 s)  
PD  
W
W
W
mJ  
A
(Note 2)  
(Note 3)  
(Note 4)  
PD  
3.3  
PD  
1.9  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
206  
-50  
Channel temperature  
Storage temperature  
(Note 5)  
Tch  
Tstg  
175  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2013-08-02  
Rev.1.0  
1

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