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TPA701_07 PDF预览

TPA701_07

更新时间: 2024-11-08 03:58:47
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页数 文件大小 规格书
25页 727K
描述
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER

TPA701_07 数据手册

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TPA701  
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER  
SLOS229D – NOVEMBER1998 – REVISED MAY 2003  
D OR DGN PACKAGE  
D
D
D
Fully Specified for 3.3-V and 5-V Operation  
(TOP VIEW)  
Wide Power Supply Compatibility  
2.5 V – 5.5 V  
SHUTDOWN  
BYPASS  
IN+  
V –  
O
GND  
1
2
3
4
8
7
6
5
Output Power for R = 8 Ω  
L
– 700 mW at V  
– 250 mW at V  
= 5 V, BTL  
DD  
DD  
V
DD  
= 3.3 V, BTL  
IN–  
V +  
O
D
Ultralow Quiescent Current in Shutdown  
Mode . . . 1.5 nA  
D
D
Thermal and Short-Circuit Protection  
Surface-Mount Packaging  
– SOIC  
– PowerPAD MSOP  
description  
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications  
where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of  
continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although  
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as  
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the  
output in most applications, which is particularly important for small battery-powered equipment. This device  
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.  
The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP,  
which reduces board space by 50% and height by 40%.  
V
6
5
DD  
V
R
DD  
F
V
DD  
/2  
Audio  
Input  
C
S
R
I
IN –  
IN+  
4
3
V
O
+
+
C
I
2
BYPASS  
C
B
700 mW  
+
V
O
8
7
GND  
SHUTDOWN  
1
Bias  
Control  
From System Control  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 1998 – 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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