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TPA711_07

更新时间： 2024-11-10 03:58:47
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德州仪器 - TI 放大器功率放大器低压音频
页数 文件大小 规格书
37页 945K
描述
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER

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TPA711  
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER  
SLOS230D – NOVEMBER 1998 – REVISED OCTOBER 2002  
D
D
D
Fully Specified for 3.3-V and 5-V Operation  
D
D
D
D
BTL to SE Mode Control  
Wide Power Supply Compatibility  
2.5 V – 5.5 V  
Integrated Depop Circuitry  
Thermal and Short-Circuit Protection  
Output Power  
Surface-Mount Packaging  
– SOIC  
– PowerPAD MSOP  
– 700 mW at V  
= 5 V, BTL, R = 8 Ω  
L
DD  
– 85 mW at V  
– 250 mW at V  
= 5 V, SE, R = 32 Ω  
DD  
L
= 3.3 V, BTL, R = 8 Ω  
L
DD  
– 37 mW at V  
= 3.3 V, SE, R = 32 Ω  
DD  
L
D OR DGN PACKAGE  
(TOP VIEW)  
D
Shutdown Control  
– I  
– I  
= 7 µA at 3.3 V  
= 50 µA at 5 V  
DD  
DD  
SHUTDOWN  
BYPASS  
SE/BTL  
IN  
V –  
O
GND  
1
2
3
4
8
7
6
5
description  
V
DD  
V +  
O
The TPA711 is a bridge-tied load (BTL) or  
single-ended (SE) audio power amplifier devel-  
oped especially for low-voltage applications where internal speakers and external earphone operation are  
required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8-Ω  
load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out  
to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL  
configuration eliminates the need for external coupling capacitors on the output in most applications, which is  
particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the  
amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated  
mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode  
for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown  
mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which  
reduces board space by 50% and height by 40%.  
V
6
5
DD  
V
R
DD  
F
V
DD  
/2  
Audio  
Input  
C
S
R
I
IN  
4
2
V
O
+
–
+
C
I
BYPASS  
C
B
700 mW  
–
+
V
O
–
8
7
GND  
SHUTDOWN  
SE/BTL  
1
3
From System Control  
From HP Jack  
Bias  
Control  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...37

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