Datasheet > TP(P12)Mini2 GB

TP(P12)Mini2 GB

更新时间： 2024-11-26 14:55:35

品牌	Logo	应用领域
赛米控丹佛斯 - SEMIKRON		/
页数	文件大小	规格书
1页	57K
描述
Thermal Interface Materials MiniSKiiP II 2

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中文翻译

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TP(P12)Mini2 GB 数据手册

TP(P12)Mini2 GB

Characteristics

Symbol Conditions

Characteristics of printing process

min.

typ.

max.

Unit

thickness of thermal paste

(after assembly)

d_tp

µm

Storage conditions

t_stg

T_stg

RH_stg

storage time

storage temperature

storage humidity

month

°C

-25

MiniSKiiP^®

Characteristics of thermal paste

specific gravity

resistivity

2.25

g/cm³

Ω/cm

kV/

(K*m)

1*10¹³

R_tp

E_tp

Pre applied thermal paste

Wacker P12 (silicone based)

dielectric strength

thermal conductivity

0.8

TP(P12)Mini2 GB

* The specifications of our components may not be considered as an assurance of

component characteristics. Components have to be tested for the respective application.

Adjustments may be necessary. The use of SEMIKRON products in life support

appliances and systems is subject to prior specification and written approval by

SEMIKRON. We therefore strongly recommend prior consultation of our staff.

Features

ꢀ Honeycomb structure

ꢀ Optimized thickness of thermal paste

layer

ꢀ Enhanced heat dissipation

ꢀ High process reliability due to

automated screen printing process

honeycomb structure

Rev. 0 – 26.02.2015

中文翻译

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与TP(P12)Mini2 GB相关器件

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TP(P12)Mini2II. Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 2
TP(P12)Mini3 GB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 3
TP(P12)Mini3I.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 3
TP(P12)Mini3II.Gen	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP II 3
TP(P12)Mini8AC	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 8
TP(P12)Mini8AxB	SEMIKRON	获取价格	Thermal Interface Materials MiniSKiiP 8
TP(P12)SEMITOP2	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP 2
TP(P12)SEMITOP3	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP 3
TP(P12)SEMITOP4	SEMIKRON	获取价格	Thermal Interface Materials SEMITOP 4