5秒后页面跳转
捷配首页

Datasheet > TMSDC6726BRFPA225
TMSDC6726BRFPA225 PDF预览

TMSDC6726BRFPA225

更新时间： 2024-10-28 03:59:03
品牌 Logo 应用领域
德州仪器 - TI 数字信号处理器
页数 文件大小 规格书
116页 1074K
描述
Floating-Point Digital Signal Processors

阅读下载

中文翻译

获取价格

TMSDC6726BRFPA225 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：QFP
包装说明：TFQFP, TQFP144,.9SQ针数：144
Reach Compliance Code：compliantECCN代码：3A991.A.2
HTS代码：8542.31.00.01Factory Lead Time：1 week
风险等级：1.79其他特性：32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY
地址总线宽度：32桶式移位器：NO
位大小：32边界扫描：YES
最大时钟频率：25 MHz外部数据总线宽度：32
格式：FLOATING POINT集成缓存：YES
内部总线架构：MULTIPLEJESD-30 代码：S-PQFP-G144
JESD-609代码：e4长度：20 mm
低功率模式：NO湿度敏感等级：4
DMA 通道数量：16端子数量：144
片上数据RAM宽度：8片上程序ROM宽度：8
最高工作温度：105 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：TFQFP
封装等效代码：TQFP144,.9SQ封装形状：SQUARE
封装形式：FLATPACK, THIN PROFILE, FINE PITCH峰值回流温度（摄氏度）：260
电源：1.2,3.3 V认证状态：Not Qualified
RAM（字数）：262144ROM可编程性：MROM
座面最大高度：1.2 mm子类别：Digital Signal Processors
最大供电电压：1.32 V最小供电电压：1.14 V
标称供电电压：1.2 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：20 mm
uPs/uCs/外围集成电路类型：DIGITAL SIGNAL PROCESSOR, OTHER

TMSDC6726BRFPA225 数据手册

 浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第2页浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第3页浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第4页浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第5页浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第6页浏览型号TMSDC6726BRFPA225的Datasheet PDF文件第7页 
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720  
Floating-Point Digital Signal Processors  
www.ti.com  
SPRS370C–SEPTEMBER 2006–REVISED OCTOBER 2007  
1 TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs  
1.1 Features  
•
•
C672x: 32-/64-Bit 350-MHz Floating-Point DSPs  
•
Three Multichannel Audio Serial Ports  
–
–
–
–
Transmit/Receive Clocks up to 50 MHz  
Six Clock Zones and 16 Serial Data Pins  
Supports TDM, I2S, and Similar Formats  
DIT-Capable (McASP2)  
Upgrades to C67x+ CPU From C67x™ DSP  
Generation:  
–
–
–
2X CPU Registers [64 General-Purpose]  
New Audio-Specific Instructions  
Compatible With the C67x CPU  
•
•
Universal Host-Port Interface (UHPI)  
–
–
32-Bit-Wide Data Bus for High Bandwidth  
Muxed and Non-Muxed Address and Data  
•
•
Enhanced Memory System  
–
–
–
–
256K-Byte Unified Program/Data RAM  
384K-Byte Unified Program/Data ROM  
Single-Cycle Data Access From CPU  
Large Program Cache (32K Byte) Supports  
RAM, ROM, and External Memory  
Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin  
Options  
•
•
•
•
Two Inter-Integrated Circuit (I2C) Ports  
Real-Time Interrupt Counter/Watchdog  
Oscillator- and Software-Controlled PLL  
Applications:  
External Memory Interface (EMIF) Supports  
–
–
133-MHz SDRAM (16- or 32-Bit)  
Asynchronous NOR Flash, SRAM (8-,16-, or  
32-Bit)  
–
Professional Audio  
•
•
•
•
•
•
•
Mixers  
Effects Boxes  
–
NAND Flash (8- or 16-Bit)  
•
•
Enhanced I/O System  
Audio Synthesis  
Instrument/Amp Modeling  
Audio Conferencing  
Audio Broadcast  
Audio Encoder  
–
–
–
High-Performance Crossbar Switch  
Dedicated McASP DMA Bus  
Deterministic I/O Performance  
dMAX (Dual Data Movement Accelerator)  
Supports:  
–
–
–
–
Emerging Audio Applications  
Biometrics  
Medical  
–
–
16 Independent Channels  
Concurrent Processing of Two Transfer  
Requests  
Industrial  
–
1-, 2-, and 3-Dimensional  
Memory-to-Memory and  
•
•
Commercial or Extended Temperature  
Memory-to-Peripheral Data Transfers  
144-Pin, 0.5-mm, PowerPAD™ Thin Quad  
Flatpack (TQFP) [RFP Suffix]  
–
–
Circular Addressing Where the Size of a  
Circular Buffer (FIFO) is not Limited to 2n  
Table-Based Multi-Tap Delay Read and  
Write Transfers From/To a Circular Buffer  
•
256-Terminal, 1.0-mm, 16x16 Array Plastic Ball  
Grid Array (PBGA) [GDH and ZDH Suffixes]  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.  
Philips is a registered trademark of Koninklijki Philips Electronics N.V.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...116

中文翻译

下载PDF

TMSDC6726BRFPA225 替代型号

型号 品牌 替代类型 描述 数据表
TMS320C6722RFPA225 TI

功能相似

 32-BIT, 25MHz, OTHER DSP, PQFP144, 20 X 20 MM, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-144

与TMSDC6726BRFPA225相关器件

型号 品牌 获取价格 描述 数据表
TMSDC6727BGDHA250 TI

获取价格

 		Floating-Point Digital Signal Processors
TMSDC6727BZDHA250 TI

获取价格

 		Floating-Point Digital Signal Processors
TMSDM6446AZWT-COM TI

获取价格

 		达芬奇数字媒体片上系统 | ZWT | 361 | 0 to 85
TMSDM6467CCUT7TAN TI

获取价格

 		数字媒体片上系统 | CUT | 529 | 0 to 85
TMSDVC5402PGE100G4 TI

获取价格

 		数字信号处理器 | PGE | 144 | 0 to 0
TMSDVC5409APGE16G4 TI

获取价格

 		Fixed-PointDigital Signal Processor
TMSDVC5410GGWR100 TI

获取价格

 		TMS320VC5410 Fixed-Point Digital Signal Processor
TMSDVC5416GGUR160 TI

获取价格

 		TMS320VC5416 Fixed-Point Digital Signal Processor
TMSH XILINX

获取价格

 		XC1800 Series of In-System Programmable Configuration PROMs
TMSH-125-01-F-D SAMTEC

获取价格

 		Board Connector, 50 Contact(s), 2 Row(s), Male, Straight, Solder Terminal,

与TMSDC6726BRFPA225相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证