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TMSDM6467CCUT7TAN PDF预览

TMSDM6467CCUT7TAN

更新时间: 2024-10-29 11:08:03
品牌 Logo 应用领域
德州仪器 - TI 控制器微控制器微控制器和处理器外围集成电路uCs集成电路uPs集成电路
页数 文件大小 规格书
355页 1747K
描述
数字媒体片上系统 | CUT | 529 | 0 to 85

TMSDM6467CCUT7TAN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HBGA,
Reach Compliance Code:compliantFactory Lead Time:6 weeks
风险等级:5.59JESD-30 代码:S-PBGA-B529
JESD-609代码:e1长度:19 mm
湿度敏感等级:4端子数量:529
最高工作温度:85 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:HBGA
封装形状:SQUARE封装形式:GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度):245座面最大高度:3.3 mm
最大供电电压:1.26 V最小供电电压:1.14 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:19 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUITBase Number Matches:1

TMSDM6467CCUT7TAN 数据手册

 浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第2页浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第3页浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第4页浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第5页浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第6页浏览型号TMSDM6467CCUT7TAN的Datasheet PDF文件第7页 
TMS320DM6467  
www.ti.com  
SPRS403H DECEMBER 2007REVISED JUNE 2012  
TMS320DM6467  
Digital Media System-on-Chip  
Check for Samples: TMS320DM6467  
1 Digital Media System-on-Chip (DMSoC)  
1.1 Features  
12  
• High-Performance Digital Media SoC  
– 594-, 729-MHz C64x+™ Clock Rate  
– 297-, 364.5-MHz ARM926EJ-S™ Clock Rate  
– Eight 32-Bit C64x+ Instructions/Cycle  
– 4752, 5832 C64x+ MIPS  
• C64x+ L1/L2 Memory Architecture  
– 32K-Byte L1P Program RAM/Cache (Direct  
Mapped)  
– 32K-Byte L1D Data RAM/Cache (2-Way Set-  
Associative)  
– 128K-Byte L2 Unified Mapped RAM/Cache  
(Flexible RAM/Cache Allocation)  
– Fully Software-Compatible With  
C64x/ARM9™  
– Supports SmartReflex™ [-594 only]  
• ARM926EJ-S Core  
– Support for 32-Bit and 16-Bit (Thumb®  
Mode) Instruction Sets  
– DSP Instruction Extensions and Single Cycle  
MAC  
– ARM® Jazelle® Technology  
– EmbeddedICE-RT™ Logic for Real-Time  
Debug  
Class 0  
1.05-V and 1.2-V Adaptive Core Voltage  
– Extended Temp Available [-594 only]  
– Industrial Temp Available [-729 only]  
• Advanced Very-Long-Instruction-Word (VLIW)  
TMS320C64x+™ DSP Core  
– Eight Highly Independent Functional Units  
• ARM9 Memory Architecture  
– 16K-Byte Instruction Cache  
– 8K-Byte Data Cache  
– 32K-Byte RAM  
– 8K-Byte ROM  
• Embedded Trace Buffer™ (ETB11™) With 4KB  
Memory for ARM9 Debug  
Six ALUs (32-/40-Bit), Each Supports  
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit  
Arithmetic per Clock Cycle  
Two Multipliers Support Four 16 x 16-Bit  
Multiplies (32-Bit Results) per Clock  
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit  
Results) per Clock Cycle  
– Load-Store Architecture With Non-Aligned  
Support  
– 64 32-Bit General-Purpose Registers  
– Instruction Packing Reduces Code Size  
– All Instructions Conditional  
• Endianness: Little Endian for ARM and DSP  
• Dual Programmable High-Definition Video  
Image Co-Processor (HDVICP) Engines  
– Supports a Range of Encode, Decode, and  
Transcode Operations  
H.264, MPEG2, VC1, MPEG4 SP/ASP  
– Additional C64x+™ Enhancements  
• 99-/108-MHz Video Port Interface (VPIF)  
Protected Mode Operation  
Exceptions Support for Error Detection  
and Program Redirection  
Hardware Support for Modulo Loop  
Operation  
– Two 8-Bit SD (BT.656), Single 16-Bit HD  
(BT.1120), or Single Raw (8-/10-/12-Bit) Video  
Capture Channels  
– Two 8-Bit SD (BT.656) or Single 16-Bit HD  
(BT.1120) Video Display Channels  
• C64x+ Instruction Set Features  
– Byte-Addressable (8-/16-/32-/64-Bit Data)  
– 8-Bit Overflow Protection  
• Video Data Conversion Engine (VDCE)  
– Horizontal and Vertical Downscaling  
– Chroma Conversion (4:2:24:2:0)  
• Two Transport Stream Interface (TSIF) Modules  
(One Parallel/Serial and One Serial Only)  
– Bit-Field Extract, Set, Clear  
– Normalization, Saturation, Bit-Counting  
– Compact 16-Bit Instructions  
– TSIF for MPEG Transport Stream  
– Simultaneous Synchronous or  
– Additional Instructions to Support Complex  
Multiplies  
Asynchronous Input/Output Streams  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2007–2012, Texas Instruments Incorporated  
 
 

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