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TMS320TCI6487GUN8 PDF预览

TMS320TCI6487GUN8

更新时间： 2024-10-27 15:54:51
品牌 Logo 应用领域
德州仪器 - TI 外围集成电路
页数 文件大小 规格书
219页 1832K
描述
32-BIT, OTHER DSP, PBGA561, 0.80 MM PITCH, PLASTIC, BGA-561

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TMS320TCI6487GUN8 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：FBGA,针数：561
Reach Compliance Code：unknown风险等级：5.83
地址总线宽度：14桶式移位器：NO
边界扫描：YES外部数据总线宽度：32
格式：FIXED POINT内部总线架构：MULTIPLE
JESD-30 代码：S-PBGA-B561长度：23 mm
低功率模式：YES端子数量：561
封装主体材料：PLASTIC/EPOXY封装代码：FBGA
封装形状：SQUARE封装形式：GRID ARRAY, FINE PITCH
认证状态：Not Qualified座面最大高度：3.3 mm
最大供电电压：1.155 V最小供电电压：1.045 V
标称供电电压：1.1 V表面贴装：YES
技术：CMOS端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
宽度：23 mmuPs/uCs/外围集成电路类型：DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches：1

TMS320TCI6487GUN8 数据手册

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TMS320TCI6487  
TMS320TCI6488  
www.ti.com  
SPRS358L–APRIL 2007–REVISED APRIL 2011  
TMS320TCI6487/8 Communications Infrastructure Digital Signal Processor  
1 Features  
12  
– Extended Temperature:  
• Key Features  
•
•
1.2-GHz Device: -40°C to 95°C  
1.0-GHz Device: -40°C to 100°C  
– High-Performance Communications  
Infrastructure DSP (TCI6487/8)  
– Instruction Cycle Time: 1.25 ns to 0.83 ns  
(1.2-GHz Device); 1.25 ns to 1 ns (1-GHz  
Device)  
– Clock Rate: 800 MHz to 1.2 GHz (1.2-GHz  
Device); 800-MHz to 1-GHz (1-GHz Device)  
– Commercial Temperature and Extended  
Temperature  
– 3 TMS320C64x+™ DSP Cores; Six RSAs for  
CDMA Processing (2 per core)  
– One Receive Accelerator (RAC) [TCI6488  
• 3 TMS320C64x+™ DSP Cores  
– Dedicated SPLOOP Instructions  
– Compact Instructions (16-Bit)  
– Exception Handling  
• TMS320C64x+ Megamodule L1/L2 Memory  
Architecture  
– 256 K-Bit (32 K-Byte) L1P Program Cache  
[Direct Mapped]  
– 256 K-Bit (32 K-Byte) L1D Data Cache  
[2-Way Set-Associative]  
– 24 M-Bit (3072 K-Byte) Total L2 Unified  
Only]  
– Enhanced VCP2/TCP2  
Mapped RAM/Cache [Flexible Allocation]  
– Frame Synchronization Interface  
– 16-/32-Bit DDR2-667 Memory Controller  
– EDMA3 Controller  
– Antenna Interface  
– Two 1x Serial RapidIO® Links, v1.2  
•
Configurable at boot-time to 1 MB/  
1 MB/1 MB or 1.5 MB/1 MB/0.5 MB  
– 512 K-Bit (64 K-Byte) L3 ROM  
• One Receive Accelerator (RAC) [TCI6488 Only]  
– Performs Chip-Rate RX Functions  
– Up to 64 Macro-BTS Users  
– Up to 160 km cell size  
• Six RSAs for CDMA Processing (2 per core)  
Compliant  
– One 1.8-V Inter-Integrated Circuit (I2C) Bus  
– Two 1.8-V McBSPs  
– 1000 Mbps Ethernet MAC (EMAC)  
– Six 64-Bit General-Purpose Timers  
– 16 General-Purpose I/O (GPIO) Pins  
– Internal Semaphore Module  
– Dedicated RAKE, PATH_SEARCH and  
RACH_SEARCH Instructions  
– Transmit Processing Capability  
• Enhanced VCP2  
– System PLL and PLL Controller/DDR PLL  
and PLL Controller, Dedicated to DDR2  
Memory Controller  
– Supports Over 694 7.95-Kbps AMR  
• Enhanced Turbo Decoder Coprocessor (TCP2)  
– Supports up to Eight 2-Mbps 3 GPP  
• High-Performance Communications  
(6 Iterations)  
• Endianness: Little Endian, Big Endian  
• Frame Synchronization Interface  
Infrastructure DSP (TCI6487/8)  
– Instruction Cycle Time:  
•
•
1.2-GHz Device: 1.25-ns to 0.83-ns(1)  
1-GHz Device: 1.25-ns to 1-ns  
– Time Alignment Between Internal  
Subsystems, External Devices/System  
– OBSAI RP1 Compliant for Frame Burst Data  
– Clock Rate:  
•
•
1.2-GHz Device: 800-MHz to 1.2-GHz  
1-GHz Device: 800-MHz to 1-GHz  
– Alternate Interfaces for non-RP1 and  
non-UMTS Systems  
– Eight 32-Bit Instructions/Cycle  
– Commercial Temperature:  
• 16-/32-Bit DDR2-667 Memory Controller  
• EDMA3 Controller (64 Independent Channels)  
• Antenna Interface  
•
•
1.2-GHz Device: 0°C to 95°C  
1-GHz Device: 0°C to 100°C  
– 6 Configurable Links (Full Duplex)  
– Supports OBSAI RP3 Protocol, v1.0:  
768-Mbps, 1.536-, 3.072-Gbps Link Rates  
– Supports CPRI Protocol V2.0: 614.4-Mbps,  
(1) Note: Advance information is presented in this document for  
the TCI6487/8 1.2-GHz device. The TCI6487/8 1.0-GHz DSP  
is a fully-qualified device.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
ADVANCE INFORMATION concerns new products in the sampling  
or preproduction phase of development. Characteristic data and other  
specifications are subject to change without notice.  
Copyright © 2007–2011, Texas Instruments Incorporated  
 
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