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TLV320DAC3202IYZJR

更新时间： 2024-11-08 13:01:39
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TLV320DAC3202  
www.ti.com  
SLAS726B –SEPTEMBER 2010–REVISED MARCH 2012  
LOW POWER HIGH FIDELITY I2S INPUT HEADSET IC  
Check for Samples: TLV320DAC3202  
1
FEATURES  
•
•
32-Step Volume Control from 4 to -59 dB  
Clocking: Internal Clock Derived from I2S  
BCLK  
•
•
•
•
•
Ground Referenced Click-Pop Free Class-G  
Stereo Headset Driver  
•
•
Package: WCSP, 0.5 mm Pitch, 2 mm x 2.5 mm  
Power Supply: Direct Battery and IO Supply  
Capable of Driving 1 VRMS at the Headset  
Driver Output, Per Channel, in Phase  
100-dB(A) Channel SNR With 6.5-mW of  
Quiescent Power Dissipation  
APPLICATIONS  
Built In Short-Circuit Protection for Preventing  
Supply Rails Overload  
•
•
•
•
•
•
Smart Phones and Music Phones  
Portable Navigation  
Supports 8-, 11.025-, 12-, 16-, 24-, 32-, 44.1-  
and 48-kHz Sample Rates  
I2C Interface for Digital Control  
Personal Media Players  
PDAs  
•
•
•
Portable Game Consoles  
HDD and Flash-Based Portable Audio Players  
Supports 16-, 20-, 24- and 32-Bit Data Width  
Supports Standard I2S, PCM, Left and Right  
Justified Formats  
•
Supports Data Mixing With Gain Options  
DESCRIPTION  
The TLV320DAC3202 is a high fidelity and low power headphone amplifier with integrated DAC and power rails.  
The small solution size and highly efficient operation maximizes battery life and performance. The digital audio  
interface supports industry standard formats such as I2S and PCM. Many features of this device such as volume  
setting, data width and sampling rate are configurable for optimum flexibility and efficiency. The headset power  
control automatically adjusts the rail voltage based on the input signal to maximize efficiency and performance.  
The control interface uses an industry standard I2C controller for ease of operation and reduction in device pin  
count.  
Table 1. ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
Tape and reel of 250  
Tape and reel of 3000  
ORDERABLE PART NUMBER  
TLV320DAC3202CYZJT  
TLV320DAC3202CYZJR  
–30ºC to 85ºC  
YZJ  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) While this part number includes the YZJ package designator, it does not conform to the standard YZJ footprint. Only the drawings below  
should be used for system design and not the YZJ drawing available from the TI Packaging website.  
Top View  
3
Bottom View  
1
2
4
5
5
4
3
2
1
A
B
C
D
A
B
C
D
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2012, Texas Instruments Incorporated  
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