是否无铅: | 不含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | CERAMIC, DIP-14 | 针数: | 14 |
Reach Compliance Code: | unknown | 风险等级: | 5.18 |
Is Samacsys: | N | 放大器类型: | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB): | 0.0008 µA | 标称共模抑制比: | 75 dB |
最大输入失调电压: | 3000 µV | JESD-30 代码: | R-GDIP-T14 |
JESD-609代码: | e0 | 长度: | 19.56 mm |
湿度敏感等级: | NOT SPECIFIED | 功能数量: | 4 |
端子数量: | 14 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
筛选级别: | MIL-38535 | 座面最大高度: | 5.08 mm |
标称压摆率: | 0.55 V/us | 子类别: | Operational Amplifier |
供电电压上限: | 16 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | TIN LEAD |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
总剂量: | MIL-38535 V | 标称均一增益带宽: | 670 kHz |
宽度: | 7.62 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TLV2264MJB | TI |
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Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264MJB | STMICROELECTRONICS |
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ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264MW | TI |
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Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264MW | STMICROELECTRONICS |
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ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264MWB | STMICROELECTRONICS |
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ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264MWB | TI |
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Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264QD | TI |
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Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264QD | STMICROELECTRONICS |
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ADVANCED LINCOMS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264QDG4 | TI |
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Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |
TLV2264QDR | TI |
获取价格 |
Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS |