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TISP3180KC-00 PDF预览

TISP3180KC-00

更新时间: 2024-11-05 21:12:07
品牌 Logo 应用领域
德州仪器 - TI 局域网电信电信集成电路
页数 文件大小 规格书
4页 97K
描述
TELECOM, SURGE PROTECTION CIRCUIT, PSFM3

TISP3180KC-00 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.76JESD-30 代码:R-PSFM-T3
功能数量:2端子数量:3
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT认证状态:Not Qualified
表面贴装:NO电信集成电路类型:SURGE PROTECTION CIRCUIT
温度等级:COMMERCIAL端子形式:THROUGH-HOLE
端子位置:SINGLEBase Number Matches:1

TISP3180KC-00 数据手册

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