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TISP30XXF3

更新时间： 2024-09-10 03:13:23
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
12页 512K
描述
LOW-VOLTAGE DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

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中文翻译

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TISP30XXF3 数据手册

 浏览型号TISP30XXF3的Datasheet PDF文件第2页浏览型号TISP30XXF3的Datasheet PDF文件第3页浏览型号TISP30XXF3的Datasheet PDF文件第4页浏览型号TISP30XXF3的Datasheet PDF文件第5页浏览型号TISP30XXF3的Datasheet PDF文件第6页浏览型号TISP30XXF3的Datasheet PDF文件第7页 
T
TISP3072F3,TISP3082F3  
N
A
I
L
P
S
M
N
O
E
O
I
L
C
B
S
S
A
R
H
L
E
I
o
V
A
R
V
*
A
LOW-VOLTAGE DUAL BIDIRECTIONAL THYRISTOR  
OVERVOLTAGE PROTECTORS  
TISP30xxF3 (LV) Overvoltage Protector Series  
Ion-Implanted Breakdown Region  
Precise and Stable Voltage  
D Package (Top View)  
Low Voltage Overshoot under Surge  
G
G
G
G
T
NC  
NC  
R
1
8
7
6
5
V
V
(BO)  
2
DRM  
DEVICE  
V
V
3
4
‘3072F3  
‘3082F3  
58  
66  
72  
82  
NC - No internal connection  
Planar Passivated Junctions  
Low Off-State Current <10 µA  
SL Package (Top View)  
1
2
3
T
G
R
Rated for International Surge Wave Shapes  
I
TSP  
A
Waveshape  
Standard  
2/10 µs  
8/20 µs  
GR-1089-CORE  
IEC 61000-4-5  
FCC Part 68  
80  
70  
60  
MD1XAB  
10/160 µs  
Device Symbol  
ITU-T K.20/21  
FCC Part 68  
10/700 µs  
50  
T
R
10/560 µs  
FCC Part 68  
45  
35  
10/1000 µs  
GR-1089-CORE  
.............................................. UL Recognized Component  
SD3XAA  
G
Description  
Terminals T, R and G correspond to the  
alternative line designators of A, B and C  
These low-voltage dual bidirectional thyristor protectors are  
designed to protect ISDN applications against transients caused  
by lightning strikes and a.c. power lines. Offered in two voltage  
variants to meet battery and protection requirements, they are  
guaranteed to suppress and withstand the listed international  
lightning surges in both polarities. Transients are initially clipped  
by breakdown clamping until the voltage rises to the breakover  
level, which causes the device to crowbar. The high crowbar  
holding current prevents d.c. latchup as the current subsides.  
These monolithic protection devices are fabricated in  
ion-implanted planar structures to ensure precise and matched  
breakover control and are virtually transparent to the system in  
normal operation.  
How To Order  
For Standard  
For Lead Free  
Termination Finish Termination Finish  
Device  
Package  
Carrier  
Order As  
Order As  
D, Small-outline Tape And Reeled TISP30xxF3DR  
TISP30xxF3DR-S  
TISP30xxF3SL-S  
TISP30xxF3  
SL,Single-in-line  
Tube  
TISP30xxF3SL  
Insert xx value corresponding to protection voltages of 72 and 82  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
MARCH 1994 - REVISED MARCH 2006  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
1234567...12

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