Datasheet > TIP35C_08

TIP35C_08

更新时间： 2022-09-19 10:22:50

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		晶体晶体管
页数	文件大小	规格书
9页	197K
描述
Complementary power transistors

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TIP35C_08 数据手册

Package mechanical data

TIP35C - TIP36C

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at : www.st.com

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TIP35CG-X-T3P-T	UTC	获取价格	HIGH POWER TRANSISTORS
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TIP35CL-X-T3P-T	UTC	获取价格	HIGH POWER TRANSISTORS