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TIM1414-2-252 PDF预览

TIM1414-2-252

更新时间: 2024-11-21 05:54:59
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体射频场效应晶体管局域网高功率电源
页数 文件大小 规格书
4页 196K
描述
HIGH POWER P1dB=33.0 dBm at 13.75 GHz to 14.5 GHz

TIM1414-2-252 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete包装说明:FLANGE MOUNT, R-CDFM-F2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.53
Is Samacsys:NBase Number Matches:1

TIM1414-2-252 数据手册

 浏览型号TIM1414-2-252的Datasheet PDF文件第2页浏览型号TIM1414-2-252的Datasheet PDF文件第3页浏览型号TIM1414-2-252的Datasheet PDF文件第4页 
MICROWAVE POWER GaAs FET  
MICROWAVE SEMICONDUCTOR  
TIM1414-2-252  
TECHNICAL DATA  
FEATURES  
„ HIGH POWER  
„ BROAD BAND INTERNALLY MATCHED FET  
P1dB=33.0 dBm at 13.75 GHz to 14.5 GHz „ HERMETICALLY SEALED PACKAGE  
„ HIGH GAIN  
G1dB=6.0 dB at 13.75 GHz to 14.5 GHz  
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )  
°
CHARACTERISTICS  
Output Power at 1dB Gain  
Compression Point  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
P1dB  
dBm 32.0 33.0  
Power Gain at 1dB Gain  
Compression Point  
G1dB  
VDS= 9V  
f= 13.75 to 14.5GHz  
dB  
5.0  
6.0  
Drain Current  
IDS1  
ηadd  
ΔTch  
A
0.85  
20  
1.1  
60  
Power Added Efficiency  
Channel Temperature Rise  
%
(VDS X IDS + Pin – P1dB)  
X Rth(c-c)  
C
°
Recommended gate resistance(Rg) : Rg= 150 Ω(MAX.)  
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )  
°
CHARACTERISTICS  
SYMBOL  
CONDITIONS  
VDS= 3V  
UNIT MIN. TYP. MAX.  
Transconductance  
gm  
mS  
600  
-3.5  
2.0  
-2.0  
-5.0  
IDS= 1.0 A  
VDS= 3V  
IDS= 30mA  
VDS= 3V  
Pinch-off Voltage  
VGSoff  
IDSS  
V
Saturated Drain Current  
A
VGS= 0V  
Gate-Source Breakdown  
Voltage  
VGSO  
Rth(c-c)  
IGS= -30μA  
V
-5  
C/W  
°
Thermal Resistance  
Channel to Case  
5.0  
6.0  
‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is  
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,  
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.  
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA  
before proceeding with design of equipment incorporating this product.  
Rev. Jul. 2006  

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