Dual N-Channel Enhancement Mode Power MOSFE
TGBLN4401-5DL8
Electrical Characteristics (@ TJ = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250μA
40
-
-
-
-
-
1
V
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
VDS = 40V, VGS = 0V
VGS = ±20V, VDS = 0V
μA
nA
-
±1 00
On Characteristics
VGS = 10V,ID = 10A
VGS = 4.5V,ID = 10A
VDS = VGS, ID = 250μA
VGS = 0V, f = 1MHz
-
-
6.8
9.2
1.6
3.8
7.5
12.5
2.5
-
mΩ
mΩ
V
RDS(ON)
Static Drain-Source On-resistance
VGS(th)
RG
Gate Threshold Voltage
Gate Resistance
1
-
Ω
Dynamic Characteristics
CISS
COSS
CRSS
Input Capacitance
-
-
-
825
377
28
-
-
-
VGS = 0V
Output Capacitance
VDS = 20V
f = 1.0MHz
pF
Reverse Transfer Capacitance
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time
Turn-on Rise Time
-
-
-
-
-
-
-
8
6
-
-
-
-
-
-
-
VDD = 20V
VGS = 10V
RG = 3Ω
ns
Turn-Off Delay Time
Turn-Off Fall Time
16
4
ID = 20A
QG
Total Gate-Charge
17
3.1
2
VDD = 20V
VGS = 10V
ID = 15A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
nC
Source-Drain Diode Characteristics
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
IS = 10A, VGS = 0V
0.8
36
21
-
-
-
V
-
-
-
ns
nC
IS = 20A, VGS = 0V
di/dt = 100A/μs
Qrr
Notes:
1. Rated according to RθJC
2. Rated according to RΘja
3. Surface−mounted on 1 inch² FR4 board, 2 oz Cu
4. Limited by maximum TJ
5. Starting TJ = 25°C, VDD = 30V, VGS = 10V, L = 0.1mH
6. TBC: To be confirmed
MTM0623A: September 2022 [2.1]
www.gmesemi.com
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