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TC58DVM72F1FT00 PDF预览

TC58DVM72F1FT00

更新时间: 2024-11-10 22:09:47
品牌 Logo 应用领域
东芝 - TOSHIBA 可编程只读存储器
页数 文件大小 规格书
34页 366K
描述
128-MBIT (16M x 8 BITS/8M x 16BITS) CMOS NAND E2PROM

TC58DVM72F1FT00 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1,
针数:48Reach Compliance Code:unknown
ECCN代码:3A991.B.1.B.1HTS代码:8542.32.00.51
风险等级:5.89备用内存宽度:8
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
长度:18.4 mm内存密度:134217728 bit
内存集成电路类型:EEPROM内存宽度:16
功能数量:1端子数量:48
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:SERIAL峰值回流温度(摄氏度):240
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12 mmBase Number Matches:1

TC58DVM72F1FT00 数据手册

 浏览型号TC58DVM72F1FT00的Datasheet PDF文件第2页浏览型号TC58DVM72F1FT00的Datasheet PDF文件第3页浏览型号TC58DVM72F1FT00的Datasheet PDF文件第4页浏览型号TC58DVM72F1FT00的Datasheet PDF文件第5页浏览型号TC58DVM72F1FT00的Datasheet PDF文件第6页浏览型号TC58DVM72F1FT00的Datasheet PDF文件第7页 
TC58DVM72A1FT00/ TC58DVM72F1FT00  
TC58DAM72A1FT00/ TC58DAM72F1FT00  
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS  
128-MBIT (16M u 8 BITS/8M x 16BITS) CMOS NAND E2PROM  
DESCRIPTION  
The TC58DxM72x1xxxx is a 128-Mbit (138,412,032) bit NAND Electrically Erasable and Programmable  
2
Read-Only Memory (NAND E PROM) organized as 528 bytes/264 words u 32 pages u 1024 blocks. The device uses  
dual power supplies (2.7 V to 3.6 V for V  
and 1.65 V to 1.95 V for V  
). The device has a 528-byte/264-words  
CC  
CCQ  
static register which allows program and read data to be transferred between the register and the memory cell array  
in 528-byte/256-words increments. The Erase operation is implemented in a single block unit (16 Kbytes  512 bytes:  
528 bytes u 32 pages/8k words + 256 words:264 words x 32 pages).  
The TC58DxM72x1xxxx is a serial-type memory device which utilizes the I/O pins for both address and data  
input/output as well as for command inputs. The Erase and Program operations are automatically executed making  
the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still  
cameras and other systems which require high-density non-volatile memory data storage.  
FEOArMTgaUenmRizoaErytSiocenll allay 528 u 32K u 8  
xꢁ  
TC58DxM72A1xxxx  
TC58DxM72F1xxxx  
264 x 32k x 16  
264 x 16  
Register  
528 u 8  
Page size  
Block size  
528 bytes  
264 words  
(16K  512) bytes  
(8k + 256) words  
xꢁ Modes  
Read, Reset, Auto Page Program  
Auto Block Erase, Status Read  
xꢁ Mode control  
Serial input/output  
Command control  
xꢁ Power supplyꢀ ꢀ ꢀ ꢀ TC58DVM72x1xxxx  
TC58DAM72x1xxxx  
2.7V to 3.6V  
Vcc:  
2.7V to 3.6V  
2.7V to 3.6V  
Vccq:  
1.65V to 1.95V  
xꢁ Program/Erase Cycles 1E5 cycle (with ECC)  
xꢁ Access time  
Cell array to register 25 Ps max  
Serial Read Cycle  
50 ns min  
xꢁ Operating current  
Read (50 ns cycle) 10 mA typ.  
Program (avg.)  
Erase (avg.)  
Standby  
10 mA typ.  
10 mA typ.  
50 PA max.  
xꢁ Package  
TSOP I 48-P-1220-0.50 (Weight:0.53g typ)  
000707EBA1  
xꢁTOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general  
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,  
when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid  
situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to  
property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most  
recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide  
for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..  
xꢁThe TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal  
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are  
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or  
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control  
instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control  
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document  
shall be made at the customer’s own risk.  
xꢁThe products described in this document are subject to the foreign exchange and foreign trade laws.  
xꢁThe information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by  
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its  
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or  
others.  
xꢁThe information contained herein is subject to change without notice.  
2003-01-24 1/34  

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