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T6C13B PDF预览

T6C13B

更新时间: 2024-09-16 20:01:59
品牌 Logo 应用领域
东芝 - TOSHIBA 驱动接口集成电路
页数 文件大小 规格书
11页 349K
描述
IC LIQUID CRYSTAL DISPLAY DRIVER, UUC272, TCP-272, Display Driver

T6C13B 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE, TAB,272P(UNSPEC)针数:272
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.76
显示模式:DOT MATRIX接口集成电路类型:LIQUID CRYSTAL DISPLAY DRIVER
JESD-30 代码:R-XUUC-N272复用显示功能:NO
底板数:240/0-BP功能数量:1
区段数:240端子数量:272
最高工作温度:75 °C最低工作温度:-20 °C
封装主体材料:UNSPECIFIED封装代码:DIE
封装等效代码:TAB,272P(UNSPEC)封装形状:RECTANGULAR
封装形式:UNCASED CHIP电源:3/5 V
认证状态:Not Qualified子类别:Other Interface ICs
最大压摆率:81.5 mA最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
电源电压1-最大:40 V电源电压1-分钟:14 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL EXTENDED端子形式:NO LEAD
端子位置:UPPER最小 fmax:20 MHz
Base Number Matches:1

T6C13B 数据手册

 浏览型号T6C13B的Datasheet PDF文件第2页浏览型号T6C13B的Datasheet PDF文件第3页浏览型号T6C13B的Datasheet PDF文件第4页浏览型号T6C13B的Datasheet PDF文件第5页浏览型号T6C13B的Datasheet PDF文件第6页浏览型号T6C13B的Datasheet PDF文件第7页 
T6C13B  
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC  
T6C13B  
COLUMN AND ROW DRIVER FOR A DOT MATRIX LCD  
The T6C13B is a 240channeloutput column and row driver for  
an STN dot matrix LCD.  
The T6C13B features a 42V LCD drive voltage and a 20MHz  
maximum operating frequency. The T6C13B is able to drive LCD  
panels with a duty ratio of up to 1 / 480.  
Features  
Display duty application  
LCD drive signal  
Data transfer  
: to 1 / 480  
: 240  
: 8bit bidirectional  
Operating frequency  
LCD drive voltage  
Power supply voltage  
Operating temperature  
: 27 MHz (V  
= 4.5 to 5.5 V)  
DD  
: 14 to 40 V  
: 2.7 to 5.5 V  
: 20 to 75°C  
LCD drive output resistance : 800 (max) (20 V, 1 / 13 bias)  
Displayoff function  
Low power consumption  
: When / DSPOF is L, all LCD drive outputs (O1 to O240) remain at the V level.  
5
: Cascade connection and auto enable transfer functions are available.  
000707EBE1  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general  
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the  
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and  
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or  
damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the  
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling  
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal  
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are  
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or  
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy  
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control  
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document  
shall be made at the customer’s own risk.  
Polyimide base film is hard and thin. Be careful not to injure yourself on the film or to scratch any other parts with the film. Try to  
design and manufacture products so that there is no chance of users touching the film after assembly, or if they do , that there is no  
chance of them injuring themselves. When cutting out the film, try to ensure that the film shavings do not cause accidents. After use,  
treat the leftover film and reel spacers as industrial waste.  
Light striking a semiconductor device generates electromotive force due to photoelectric effects. In some cases this can cause the  
device to malfunction.  
This is especially true for devices in which the surface (back), or side of the chip is exposed. When designing circuits, make sure  
that devices are protected against incident light from external sources. Exposure to light both during regular operation and during  
inspection must be taken into account.  
The products described in this document are subject to the foreign exchange and foreign trade laws.  
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by  
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its  
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or  
others.  
The information contained herein is subject to change without notice.  
2001-02-05 1/11  

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