NZ9F2V4ST5G,
SZNZ9F2V4ST5G SERIES
Zener Voltage Regulators
250 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
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Specification Features
Cathode
Anode
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 250 mW
• Small Body Outline Dimensions:
MARKING
DIAGRAM
2
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm)
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• ESD Rating of Class 3 (>16 kV) per Human Body Model
X MG
SOD−923
CASE 514AB
G
• Tight Tolerance V
Z
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2
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
X
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
• These are Pb−Free Devices
(Note: Microdot may be in either location)
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
ORDERING INFORMATION
Device
Package
Shipping†
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
NZ9FxxxST5G,
SZNZ9FxxxST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
(Note 1) @ T = 25°C
250
2.0
mW
mW/°C
A
Derate above 25°C
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Thermal Resistance from
Junction−to−Ambient
R
500
°C/W
q
JA
Junction and Storage Temperature Range
T , T
−65 to
+150
°C
J
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2014
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Publication Order Number:
July, 2014 − Rev. 3
NZ9F2V4S/D