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SSW2N80A PDF预览

SSW2N80A

更新时间: 2024-10-28 03:17:55
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 264K
描述
Advanced Power MOSFET

SSW2N80A 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknown风险等级:5.82
雪崩能效等级(Eas):213 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:800 V
最大漏极电流 (Abs) (ID):2 A最大漏极电流 (ID):2 A
最大漏源导通电阻:6 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):80 W
最大脉冲漏极电流 (IDM):8 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSW2N80A 数据手册

 浏览型号SSW2N80A的Datasheet PDF文件第2页浏览型号SSW2N80A的Datasheet PDF文件第3页浏览型号SSW2N80A的Datasheet PDF文件第4页浏览型号SSW2N80A的Datasheet PDF文件第5页浏览型号SSW2N80A的Datasheet PDF文件第6页浏览型号SSW2N80A的Datasheet PDF文件第7页 
SSW/I2N80A  
Advanced Power MOSFET  
FEATURES  
BVDSS = 800 V  
RDS(on) = 6.0 W  
ID = 2 A  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
Improved Gate Charge  
Extended Safe Operating Area  
Lower Leakage Current : 25 mA (Max.) @ VDS = 800V  
Low RDS(ON) : 4.688 W (Typ.)  
D2-PAK  
I2-PAK  
2
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Drain-to-Source Voltage  
Value  
Units  
VDSS  
V
800  
2
O
Continuous Drain Current (TC=25 C)  
ID  
A
O
Continuous Drain Current (TC=100 C)  
1.3  
1
IDM  
VGS  
EAS  
IAR  
Drain Current-Pulsed  
O
A
V
8
+
_
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
30  
2
O
1
O
mJ  
A
213  
2
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
1
8
O
3
O
2.0  
3.1  
80  
O
Total Power Dissipation (TC=25 C)  
PD  
TJ , TSTG  
TL  
O
Linear Derating Factor  
W/ C  
Operating Junction and  
0.64  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
- 55 to +150  
O
C
Purposes, 1/8“ from case for 5-seconds  
300  
Thermal Resistance  
Symbol  
Characteristic  
Typ.  
Max.  
Units  
Rq  
Junction-to-Case  
--  
--  
--  
1.56  
40  
JC  
O
Rq  
*
Junction-to-Ambient  
Junction-to-Ambient  
C/W  
JA  
JA  
Rq  
62.5  
*
When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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