SST26VF064B / SST26VF064BA
2.5V/3.0V 64 Mbit Serial Quad I/O (SQI) Flash Memory
• Security ID
Features
- One-Time Programmable (OTP) 2 KByte, Secure ID
- 64 bit unique, factory pre-programmed identifier
- User-programmable area
• Single Voltage Read and Write Operations
- 2.7-3.6V or 2.3-3.6V
• Serial Interface Architecture
• Temperature Range
- Nibble-wide multiplexed I/O’s with SPI-like serial
command structure
- Industrial: -40°C to +85°C
- Extended: -40°C to +105°C
- Mode 0 and Mode 3
• Packages Available
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol
• High Speed Clock Frequency
- 8-contact WDFN (6mm x 5mm)
- 8-contact WDFN (6mm x 8 mm)
- 8-lead SOIJ (5.28 mm)
- 16-lead SOIC (7.50 mm)
- 24-ball TBGA (6mm x 8mm)
- 2.7-3.6V: 104 MHz max
- 2.3-3.6V: 80 MHz max
• Burst Modes
- Continuous linear burst
- 8/16/32/64 Byte linear burst with wrap-around
• All devices are RoHS compliant
• Superior Reliability
Product Description
- Endurance: 100,000 Cycles (min)
The Serial Quad I/O™ (SQI™) family of flash-memory
devices features a six-wire, 4-bit I/O interface that
allows for low-power, high-performance operation in a
low pin-count package. SST26VF064B/064BA also
support full command-set compatibility to traditional
Serial Peripheral Interface (SPI) protocol. System
designs using SQI flash devices occupy less board
space and ultimately lower system costs.
- Greater than 100 years Data Retention
• Low Power Consumption:
- Active Read current: 15 mA (typical @ 104 MHz)
- Standby Current: 15 µA (typical)
• Fast Erase Time
- Sector/Block Erase: 18 ms (typ), 25ms (max)
- Chip Erase: 35 ms (typ), 50 ms (max)
• Page-Program
All members of the 26 Series, SQI family are manufac-
tured with proprietary, high-performance CMOS Super-
Flash® technology. The split-gate cell design and thick-
oxide tunneling injector attain better reliability and man-
ufacturability compared with alternate approaches.
- 256 Bytes per page in x1 or x4 mode
• End-of-Write Detection
- Software polling the BUSY bit in status register
• Flexible Erase Capability
SST26VF064B/064BA significantly improve perfor-
mance and reliability, while lowering power consump-
tion. These devices write (Program or Erase) with a
single power supply of 2.3-3.6V. The total energy con-
sumed is a function of the applied voltage, current, and
time of application. Since for any given voltage range,
the SuperFlash technology uses less current to pro-
gram and has a shorter erase time, the total energy
consumed during any Erase or Program operation is
less than alternative flash memory technologies.
- Uniform 4 KByte sectors
- Four 8 KByte top and bottom parameter
overlay blocks
- One 32 KByte top and bottom overlay block
- Uniform 64 KByte overlay blocks
• Write-Suspend
- Suspend Program or Erase operation to access
another block/sector
• Software Reset (RST) mode
• Software Protection
SST26VF064B/064BA are offered in 8-contact WDFN
(6 mm x 5 mm or 6mm x 8mm), 8-lead SOIJ (5.28 mm),
16-lead SOIC (7.50 mm), and 24-ball TBGA. See Fig-
ure 2-2 for pin assignments.
- Individual-Block Write Protection with permanent
lock-down capability
- 64 KByte blocks, two 32 KByte blocks, and
eight 8 KByte parameter blocks
Two configurations are available upon order.
SST26VF064B default at power-up has the WP# and
HOLD# pins enabled, and the SIO2 and SIO3 pins dis-
- Read Protection on top and bottom 8 KByte
parameter blocks
abled,
to
initiate
SPI-protocol
operations.
2015 Microchip Technology Inc.
DS20005119G-page 1