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SQJ844EP

更新时间： 2024-10-14 11:58:39
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威世 - VISHAY /
页数 文件大小 规格书
9页 156K
描述
Automotive Dual N-Channel 30 V (D-S) 175 °C MOSFET

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SQJ844EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 30 V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Halogen-free According to IEC 61249-2-21  
Definition  
• TrenchFET® Power MOSFET  
• AEC-Q101 Qualifiedd  
• 100 % Rg and UIS Tested  
• Compliant to RoHS Directive 2002/95/EC  
30  
0.024  
0.037  
8
RDS(on) (Ω) at VGS = 10 V  
RDS(on) (Ω) at VGS = 4.5 V  
ID (A) per leg  
Configuration  
Dual  
D
1
D
2
PowerPAK® SO-8L Dual  
6.15 mm  
G
1
G
2
D
2
D
1
4
2
G
3
S
1
S
S
2
2
2
1
N-Channel MOSFET  
N-Channel MOSFET  
G
1
1
S
Bottom View  
ORDERING INFORMATION  
Package  
PowerPAK SO-8L  
SQJ844EP-T1-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
30  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
TC = 125 °C  
8
8
Continuous Drain Currenta  
ID  
Continuous Source Current (Diode Conduction)a  
Pulsed Drain Currentb  
IS  
8
A
IDM  
IAS  
EAS  
32  
22  
24.2  
48  
16  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
mJ  
W
TC = 25 °C  
TC = 125 °C  
Maximum Power Dissipationb  
PD  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
TJ, Tstg  
- 55 to + 175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
85  
UNIT  
Junction-to-Ambient  
PCB Mountc  
°C/W  
Junction-to-Case (Drain)  
RthJC  
3.1  
Notes  
a. Package limited.  
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. Parametric verification ongoing.  
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L. The end of the lead terminal is exposed copper (not plated) as a  
result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to  
ensure adequate bottom side solder interconnection.  
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S11-2288-Rev. C, 28-Nov-11  
Document Number: 65530  
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
1234567...9

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