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SQJ940EP

更新时间: 2024-10-15 14:52:55
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威世 - VISHAY /
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14页 263K
描述
Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFETs

SQJ940EP 数据手册

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SQJ940EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFETs  
FEATURES  
PRODUCT SUMMARY  
• TrenchFET® Power MOSFET  
• AEC-Q101 Qualifiedd  
N-CHANNEL 1 N-CHANNEL 2  
VDS (V)  
40  
40  
• 100 % Rg and UIS Tested  
• Material categorization:  
For definitions of compliance please see  
www.vishay.com/doc?99912  
R
DS(on) () at VGS = 10 V  
DS(on) () at VGS = 4.5 V  
0.0160  
0.0188  
15  
0.0064  
0.0076  
18  
R
ID (A)  
Configuration  
Dual N  
PowerPAK® SO-8L Asymmetric  
D
1
D
2
D2  
G
G
2
1
D1  
4
G2  
3
S2  
S
S
2
2
1
G1  
1
S1  
N-Channel 1 MOSFET  
N-Channel 2 MOSFET  
Bottom View  
ORDERING INFORMATION  
Package  
PowerPAK SO-8L Dual Asymmetric  
SQJ940EP-T1-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
40  
40  
V
VGS  
20  
TC = 25 °C  
15  
15  
18  
10.5  
39  
Continuous Drain Currenta  
ID  
TC = 125 °C  
Continuous Source Current (Diode Conduction)a  
Pulsed Drain Currentb  
IS  
15  
A
IDM  
IAS  
60  
72  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
20.5  
21  
35.5  
63  
L = 0.1 mH  
EAS  
mJ  
W
TC = 25 °C  
48  
43  
Maximum Power Dissipationb  
PD  
TC = 125 °C  
16  
14  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
TJ, Tstg  
- 55 to + 175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Junction-to-Ambient  
PCB Mountc  
70  
70  
°C/W  
Junction-to-Case (Drain)  
RthJC  
3.3  
3.5  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. Parametric verification ongoing.  
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S13-0567-Rev. A, 18-Mar-13  
Document Number: 62767  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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