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SQJ990EP-T1_GE3

更新时间： 2024-09-16 22:58:11
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 367K
描述
MOSFET 2 N-CH 100V POWERPAK SO8

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SQJ990EP-T1_GE3 数据手册

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SQJ990EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 100 V (D-S) 175 °C MOSFETs  
FEATURESS  
• TrenchFET® power MOSFET  
PowerPAK® SO-8L Dual Asymmetric  
• AEC-Q101 qualified  
D1  
• 100 % Rg and UIS tested  
• Optimized for synchronous buck applications  
D2  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S1  
2
G1  
3
S2  
4
G2  
1
D1  
D2  
Top View  
Bottom View  
PRODUCT SUMMARY  
N-CHANNEL 1  
N-CHANNEL 2  
V
DS (V)  
100  
0.0400  
0.0505  
17  
100  
0.0190  
0.0235  
34  
G 1  
G 2  
R
DS(on) () at VGS = 10 V  
DS(on) () at VGS = 4.5 V  
R
ID (A)  
Configuration  
Package  
Dual N  
PowerPAK SO-8L Dual Asymmetric  
S1  
N-Channel 1 MOSFET  
S2  
N-Channel 2 MOSFET  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
100  
100  
V
VGS  
20  
T
C = 25 °C  
17  
10  
34  
19  
Continuous Drain Current  
ID  
T
C = 125 °C  
Continuous Source Current (Diode conduction)  
Pulsed Drain Current b  
IS  
20 a  
44  
A
IDM  
IAS  
EAS  
40  
80  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
17  
28  
L = 0.1 mH  
14.4  
27  
39.2  
48  
mJ  
W
TC = 25 °C  
Maximum Power Dissipation b  
PD  
TC = 125 °C  
9
16  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Junction-to-Ambient  
PCB mount c  
85  
85  
°C/W  
Junction-to-Case (Drain)  
RthJC  
5.5  
3.1  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S16-1496-Rev. A, 25-Jul-16  
Document Number: 77789  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
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