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SQJ262EP PDF预览

SQJ262EP

更新时间: 2024-11-06 14:53:07
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威世 - VISHAY /
页数 文件大小 规格书
12页 383K
描述
Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFETs

SQJ262EP 数据手册

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SQJ262EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFETs  
FEATURESS  
• TrenchFET® power MOSFET  
PowerPAK® SO-8L Dual Asymmetric  
• AEC-Q101 qualified  
D1  
• 100 % Rg and UIS tested  
• Optimized for synchronous buck applications  
D2  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S1  
2
G1  
3
S2  
4
G2  
1
D1  
D2  
Top View  
Bottom View  
PRODUCT SUMMARY  
N-CHANNEL 1  
N-CHANNEL 2  
VDS (V)  
60  
60  
G 1  
G 2  
R
DS(on) () at VGS = 10 V  
DS(on) () at VGS = 4.5 V  
0.0355  
0.0480  
15  
0.0155  
0.0200  
40  
R
ID (A)  
Configuration  
Package  
Dual  
PowerPAK SO-8L asymmetric  
S1  
N-Channel 1 MOSFET  
S2  
N-Channel 2 MOSFET  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
60  
60  
V
VGS  
20  
T
C = 25 °C  
15 a  
11  
15 a  
40  
23  
44  
70  
20  
20  
48  
16  
Continuous drain current  
ID  
T
C = 125 °C  
Continuous source current (diode conduction)  
Pulsed drain current b  
IS  
A
IDM  
IAS  
30  
Single pulse avalanche current  
Single pulse avalanche energy  
12  
L = 0.1 mH  
EAS  
7.2  
27  
mJ  
W
TC = 25 °C  
Maximum power dissipation b  
PD  
TC = 125 °C  
9
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Junction-to-ambient  
PCB mount c  
85  
85  
°C/W  
Junction-to-case (drain)  
RthJC  
5.5  
3.1  
Notes  
a. Package limited  
b. Pulse test; pulse width 300 μs, duty cycle 2 %  
c. When mounted on 1" square PCB (FR4 material)  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S17-0665-Rev. A, 15-May-17  
Document Number: 75504  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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