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SQJ200EP PDF预览

SQJ200EP

更新时间: 2024-11-06 01:23:23
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威世 - VISHAY /
页数 文件大小 规格书
13页 377K
描述
Automotive Dual N-Channel 12 V (D-S) 175 °C MOSFETs

SQJ200EP 数据手册

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SQJ202EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 12 V (D-S) 175 °C MOSFETs  
FEATURES  
• TrenchFET® power MOSFET  
• AEC-Q101 qualified d  
PRODUCT SUMMARY  
N-CHANNEL 1  
N-CHANNEL 2  
VDS (V)  
12  
12  
• 100 % Rg and UIS tested  
R
DS(on) (Ω) at VGS = 10 V  
DS(on) (Ω) at VGS = 4.5 V  
0.0065  
0.0093  
20  
0.0033  
0.0045  
60  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
R
ID (A)  
Configuration  
Package  
Dual N  
PowerPAK® SO-8L Dual Asymmetric  
D
1
D
2
PowerPAK® SO-8L Dual Asymmetric  
D1  
G
G
2
1
D2  
1
S1  
2
G1  
3
S2  
S
1
S
2
4
G2  
1
N-Channel 1 MOSFET  
N-Channel 2 MOSFET  
Top View  
Bottom View  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
12  
12  
V
VGS  
20  
TC = 25 °C  
20  
20  
60  
60  
Continuous Drain Current a  
ID  
T
C = 125 °C  
Continuous Source Current (Diode Conduction)  
Pulsed Drain Current b  
IS  
20a  
44  
A
IDM  
IAS  
EAS  
80  
180  
18  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
18  
L = 0.1 mH  
16.2  
27  
16.2  
48  
mJ  
W
TC = 25 °C  
Maximum Power Dissipation b  
PD  
TC = 125 °C  
9
16  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) e, f  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
N-CHANNEL 1  
N-CHANNEL 2  
UNIT  
Junction-to-Ambient  
PCB Mount c  
85  
85  
°C/W  
Junction-to-Case (Drain)  
RthJC  
5.5  
3.1  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. Parametric verification ongoing.  
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S15-2474-Rev. A, 19-Oct-15  
Document Number: 62926  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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