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SPC5676RDK2MVY1 PDF预览

SPC5676RDK2MVY1

更新时间: 2024-10-29 02:52:19
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恩智浦 - NXP PC微控制器
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描述
MPC5676R Microcontroller Data Sheet

SPC5676RDK2MVY1 数据手册

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Freescale Semiconductor  
Data Sheet: Advance Information  
Document Number: MPC5676R  
Rev. 4, 16 Feb 2016  
MPC5676R  
MPC5676R Microcontroller  
Data Sheet  
TEPBGA–416  
27 mm x 27 mm  
TEPBGA–516  
27mm x 27mm  
On-chip modules available within the family include the  
following features:  
– Up to 96 eTPU2 channels (32 channels per eTPU2)  
– total of 36 KB code RAM  
– total of 9 KB parameter RAM  
• Two identical dual issue, 32-bit CPU core complexes  
(e200z7), each with  
• Enhanced modular input output system supporting 32  
unified channels (eMIOS) with each channel capable of  
single action, double action, pulse width modulation  
(PWM) and modulus counter operation  
• Two enhanced queued analog-to-digital converter  
(eQADC) modules with  
– Power Architecture embedded specification compliance  
– Instruction set enhancement allowing variable length  
encoding (VLE), optional encoding of mixed 16-bit and  
32-bit instructions, for code size footprint reduction  
– Signal processing extension (SPE) instruction support  
for digital signal processing (DSP)  
– two separate analog converters per eQADC module  
– support for a total of 64 analog input pins, expandable to  
176 inputs with off-chip multiplexers  
– Single-precision floating point operations (FPU)  
– 16 KB I-Cache and 16 KB D-Cache  
– Hardware cache coherency between cores  
• 16 Hardware semaphores  
• 3 channel CRC module  
• 6MB on-chip flash  
– Supports read during program and erase operations, and  
multiple blocks allowing EEPROM emulation  
• 384KB on-chip general-purpose SRAM including 48KB of  
standby RAM  
• Two multi-channel direct memory access controllers  
(eDMA)  
– one absolute reference ADC channel  
– interface to twelve hardware decimation filters  
– enhanced ‘Tap’ command to route any conversion to two  
separate decimation filters  
– Temperature sensor  
• Five deserial serial peripheral interface (DSPI) modules  
• Three enhanced serial communication interface (eSCI)  
modules  
• Four controller area network (FlexCAN) modules  
• Dual-channel FlexRay controller  
• Nexus development interface (NDI) per IEEE-ISTO  
5001-2003 standard, with some support for 2010 standard.  
• Device and board test support per Joint Test Action Group  
(JTAG) (IEEE 1149.1)  
• On-chip voltage regulator controller regulates supply  
voltage down to 1.2 V for core logic  
– 64 channels per eDMA  
• Dual core Interrupt controller (INTC)  
• Phase-locked loop with FM modulation (FMPLL)  
• Crossbar switch architecture for concurrent access to  
peripherals, flash, or RAM from multiple bus masters  
• External Bus Interface (EBI) for calibration and  
application development  
• Self Test capability  
• System integration unit (SIU) with error correction status  
module (ECSM)  
• Four protected port output pins (PPO)  
• Boot assist module (BAM) supports serial bootload via  
CAN or SCI  
• Three second-generation enhanced time processor units  
(eTPU2)  
This document contains information on a product under development. Freescale reserves  
the right to change or discontinue this product without notice.  
© Freescale Semiconductor, Inc., 2016. All rights reserved.  

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