NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5645S
Rev. 14, 08/2020
MPC5645S
208 LQFP
28 mm × 28 mm
416 TEPBGA
27 mm × 27 mm
MPC5645S Microcontroller
Data Sheet
176 LQFP
24 mm × 24 mm
1
2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Device comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.4 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pinout and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . 24
2.1 176 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 24
2.2 208 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 25
2.3 416 TEPBGA package pinout. . . . . . . . . . . . . . . . . . . . 26
2.4 Signal description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
System design information. . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.1 Power-up sequencing. . . . . . . . . . . . . . . . . . . . . . . . . . 60
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 61
4.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 61
4.4 Recommended operating conditions . . . . . . . . . . . . . . 62
4.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 64
4.6 EMI (electromagnetic interference) characteristics . . . 69
4.7 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4.8 DC electrical specifications . . . . . . . . . . . . . . . . . . . . . 74
4.9 SSD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.10 RESET electrical characteristics . . . . . . . . . . . . . . . . . 84
4.11 Fast external crystal oscillator (4–16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
The MPC5645S represents a new generation of 32-bit
microcontrollers targeting single-chip automotive instrument
cluster applications. MPC5645S devices are part of the
®
MPC56xxS family of Power Architecture -based devices.
This family has been designed with an emphasis on providing
cost-effective and high quality graphics capabilities in order
to satisfy the increasing market demand for color Thin Film
Transistor (TFT) displays within the vehicle cockpit.
Traditional cluster functions, such as gauge drive, real time
counter, and sound generation are also integrated on each
device.
3
4
Devices in the MPC56xxS family contain between 256 KB
and 2 MB internal flash memory. The family allows for easy
expansion and covers a broad range of cluster applications
from low to high-end enabling users to design a complete
platform around one common architecture. Serial flash
memory and DRAM interfaces are provided to allow even
greater system flexibility.
The MPC5645S is designed to reduce development and
production costs of TFT-based instrument cluster displays by
providing a single-chip solution with the processing and
storage capacity to host and execute real-time application
software and drive TFT displays directly.
4.12 Slow external crystal oscillator (32 KHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
4.13 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 89
4.14 Fast internal RC oscillator (16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
The MPC5645S features a 2D OpenVG graphics accelerator,
Video Input Unit (VIU2) and two on-chip display control
units (DCU3 and DCULite) designed to drive two color TFT
displays simultaneously. The MPC5645S includes an
enhanced QuadSPI Serial Flash Controller and an optional
DRAM controller allowing graphics RAM expansion
externally.
4.15 Slow internal RC oscillator (128 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
4.16 Flash memory electrical characteristics . . . . . . . . . . . . 91
4.17 ADC parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
4.18 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
4.19 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 135
5.1 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
5.2 208 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
5.3 416 TEPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
5
The MPC5645S is compatible with the existing development
infrastructure of current Power Architecture devices and are
supported with software drivers, operating systems and
configuration code to assist with application development.
6
7
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
5秒后页面跳转
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
