Datasheet > SPC564A70L7

SPC564A70L7

更新时间： 2024-10-29 01:21:47

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
133页	984K
描述
Up to 4 multiply and accumulate operations per cycle

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SPC564A70L7 数据手册

SPC564A70B4, SPC564A70L7

32-bit Power Architecture^®based MCU for automotive

powertrain applications

Datasheet

−

preliminary data

Features

■

150 MHz e200z4 Power Architecture^®core

PBGA324 (23 mm x 23 mm)

LQFP176 (24 mm x 24 mm)

– Variable length instruction encoding (VLE)

– 1 FlexRay module (V2.1) up to 10 Mbit/s

w/dual or single channel, 128 message

objects, ECC

– Superscalar architecture with 2 execution

units

– Up to 2 integer or floating point instructions

per cycle

■

1 eMIOS (24 unified channels)

– Up to 4 multiply and accumulate operations

per cycle

1 eTPU2 (second generation eTPU)

– 32 standard channels

■

Memory organization

– 1 reaction module (6 channels with 3

outputs per channel)

– 2 MB on-chip flash memory with ECC and

read-while-write (RWW)

■

2 enhanced queued analog-to-digital

converters (eQADCs)

– 128 KB on-chip SRAM with standby

functionality (32 KB) and ECC

– Forty 12-bit input channels

– 8 KB instruction cache (with line locking),

configurable as 2- or 4-way

– 688 ns minimum conversion time

On-chip CAN/SCI Bootstrap loader with Boot

Assist Module (BAM)

– 14 + 3 KB eTPU code and data RAM

– 4 × 4 crossbar switch (XBAR)

– 24-entry MMU

■

Nexus: Class 3+ for core; Class 1 for eTPU

JTAG (5-pin)

■

Fail Safe Protection

Development Trigger Semaphore (DTS)

– 16-entry Memory Protection Unit (MPU)

– CRC unit with 3 submodules

– Junction temperature sensor

Clock generation

– On-chip 4–40 MHz main oscillator

– On-chip FMPLL (frequency-modulated

phase-locked loop)

■

Interrupt

– Configurable interrupt controller (INTC)

with non-maskable interrupt (NMI)

■

Up to 112 general purpose I/O lines

– 64-channel eDMA

Power reduction modes: slow, stop, and

standby

Serial channels

■

Flexible supply scheme

– 3 eSCI modules

– 5 V single supply with external ballast

– 3 DSPI modules (2 of which support

downstream Micro Second Channel [MSC])

– Multiple external supply: 5 V, 3.3 V , and

1.2 V

– 3 FlexCAN modules with 64 message

buffers each

■

Designed for LQFP176, LBGA208, PBGA324

Table 1.

Device summary

Part number

Memory Flash size

Package LQFP176

Package LBGA208

Package PBGA324

2MB

SPC564A70L7

SPC564A70B4

September 2013

Doc ID 18078 Rev 4

1/133

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

www.st.com

12 3 4 5 6 7...133

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与SPC564A70L7相关器件

型号	品牌	获取价格	描述	数据表
SPC564A70L7CFAR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A70L7CFAY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A70L7CFBR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A70L7CFBY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A70L7COBR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A70L7COBY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A74B4	STMICROELECTRONICS	获取价格	Up to 4 multiply and accumulate operations per cycle
SPC564A74L7	STMICROELECTRONICS	获取价格	Up to 4 multiply and accumulate operations per cycle
SPC564A80B4	STMICROELECTRONICS	获取价格	Up to 4 multiply and accumulate operations per cycle
SPC564A80B4CFAR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU

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