Datasheet > SPC564A80L7

SPC564A80L7

更新时间： 2024-10-29 01:09:51

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
157页	1082K
描述
Up to 4 multiply and accumulate operations per cycle

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中文翻译

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数据手册

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SPC564A80L7 数据手册

SPC564A74B4, SPC564A74L7,

SPC564A80B4, SPC564A80L7

32-bit MCU family built on the embedded Power Architecture^®

Features

■ 150 MHz e200z4 Power Architecture core

LBGA208

PBGA324

LQFP176

– Variable length instruction encoding (VLE)

– Superscalar architecture with 2 execution

units

– Up to 2 integer or floating point instructions

per cycle

– 3  FlexCAN with 64 messages each

– 1  FlexRay module (V2.1) up to 10 Mbit/s

with dual or single channel and 128

message objects and ECC

– Up to 4 multiply and accumulate operations

per cycle

■ 1  eMIOS

■ 1  eTPU2 (second generation eTPU)

■ Memory organization

■ 2 enhanced queued analog-to-digital

– 4 MB on-chip flash memory with ECC and

Read While Write (RWW)

– 192 KB on-chip RAM with standby

functionality (32 KB) and ECC

converters (eQADCs)

■ On-chip CAN/SCI/FlexRay Bootstrap loader

with Boot Assist Module (BAM)

■ Nexus: Class 3+ for core; Class 1 for the eTPU

■ JTAG (5-pin)

– 8 KB instruction cache (with line locking),

configurable as 2- or 4-way

– 14 + 3 KB eTPU code and data RAM

– 5  4 crossbar switch (XBAR)

– 24-entry MMU

■ Development Trigger Semaphore (DTS)

■ Clock generation

– On-chip 4–40 MHz main oscillator

– On-chip FMPLL (frequency-modulated

phase-locked loop)

– External Bus Interface (EBI) with slave and

master port

■ Fail Safe Protection

■ Up to 120 general purpose I/O lines

– 16-entry Memory Protection Unit (MPU)

– CRC unit with 3 sub-modules

– Junction temperature sensor

■ Power reduction mode: slow, stop and stand-

by modes

■ Flexible supply scheme

■ Interrupts

– 5 V single supply with external ballast

– Multiple external supply: 5 V, 3.3 V and

1.2 V

– Configurable interrupt controller (with NMI)

– 64-channel DMA

■ Serial channels

– 3  eSCI

■ Designed for LQFP176, LBGA208, PBGA324

and Known Good Die (KGD)

– 3  DSPI (2 of which support downstream

Micro Second Channel [MSC])

Table 1.

Device summary

Part number

Memory Flash

size

Package LQFP176

Package: LBGA208

Package: PBGA324

KGD

4MB

3MB

SPC564A80L7

SPC564A74L7

SPC564A80B4

SPC564A74B4

September 2013

Doc ID 15399 Rev 9

1/157

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与SPC564A80L7相关器件

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SPC564A80L7CFAR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A80L7CFAY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A80L7CFBR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A80L7CFBY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A80L7COBR	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564A80L7COBY	STMICROELECTRONICS	获取价格	用于汽车动力系统应用的32位Power Architecture MCU
SPC564AADPT324S	STMICROELECTRONICS	获取价格	SPC563Mxx, SPC564Axx microcontroller family evaluation board
SPC564B64L7	STMICROELECTRONICS	获取价格	用于汽车车身和网关应用的32位Power Architecture MCU
SPC564B64L7C800X	STMICROELECTRONICS	获取价格	用于汽车车身和网关应用的32位Power Architecture MCU
SPC564B64L7C800Y	STMICROELECTRONICS	获取价格	用于汽车车身和网关应用的32位Power Architecture MCU

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