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Datasheet > SN74V225-20PAG
SN74V225-20PAG PDF预览

SN74V225-20PAG

更新时间： 2024-11-21 04:13:47
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
43页 591K
描述
512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES

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中文翻译

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SN74V225-20PAG 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFP
包装说明：TFQFP, TQFP64,.47SQ针数：64
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.32.00.71Factory Lead Time：1 week
风险等级：5.67最长访问时间：12 ns
最大时钟频率 (fCLK)：50 MHz周期时间：20 ns
JESD-30 代码：S-PQFP-G64JESD-609代码：e4
长度：10 mm内存密度：18432 bit
内存集成电路类型：OTHER FIFO内存宽度：18
湿度敏感等级：3功能数量：1
端子数量：64字数：1024 words
字数代码：1000工作模式：SYNCHRONOUS
最高工作温度：70 °C最低工作温度：
组织：1KX18可输出：YES
封装主体材料：PLASTIC/EPOXY封装代码：TFQFP
封装等效代码：TQFP64,.47SQ封装形状：SQUARE
封装形式：FLATPACK, THIN PROFILE, FINE PITCH并行/串行：PARALLEL
峰值回流温度（摄氏度）：260电源：3.3 V
认证状态：Not Qualified座面最大高度：1.2 mm
子类别：FIFOs最大压摆率：0.035 mA
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：3 V
标称供电电压 (Vsup)：3.3 V表面贴装：YES
技术：CMOS温度等级：COMMERCIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：10 mm
Base Number Matches：1

SN74V225-20PAG 数据手册

 浏览型号SN74V225-20PAG的Datasheet PDF文件第2页浏览型号SN74V225-20PAG的Datasheet PDF文件第3页浏览型号SN74V225-20PAG的Datasheet PDF文件第4页浏览型号SN74V225-20PAG的Datasheet PDF文件第5页浏览型号SN74V225-20PAG的Datasheet PDF文件第6页浏览型号SN74V225-20PAG的Datasheet PDF文件第7页 
SN74V215, SN74V225, SN74V235, SN74V245  
512 × 18, 1024 × 18, 2048 × 18, 4096 × 18  
DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES  
SCAS636E – APRIL 2000 – REVISED SEPTEMBER 2002  
512 × 18-Bit Organization Array (SN74V215)  
Asynchronous or Coincident Read and  
Write Clocks  
1024 × 18-Bit Organization Array  
(SN74V225)  
Asynchronous or Synchronous  
Programmable Almost-Empty and  
Almost-Full Flags With Default Settings  
2048 × 18-Bit Organization Array  
(SN74V235)  
Half-Full Flag Capability  
4096 × 18-Bit Organization Array  
(SN74V245)  
Output Enable Puts Output Data Bus in  
High-Impedance State  
7.5-ns Read/Write Cycle Time  
High-Performance Submicron CMOS  
Technology  
3.3-V V , 5-V Input Tolerant  
CC  
First-Word or Standard Fall-Through  
Timing  
Packaged in 64-Pin Thin Quad Flat Package  
DSP and Microprocessor Interface Control  
Logic  
Single or Double Register-Buffered Empty  
and Full Flags  
Provide a DSP Glueless Interface to Texas  
Instruments TMS320 DSPs  
Easily Expandable in Depth and Width  
description  
TheSN74V215, SN74V225, SN74V235, andSN74V245areveryhigh-speed, low-powerCMOSclockedfirst-in  
first-out (FIFO) memories. They support clock frequencies up to 133 MHz and have read-access times as fast  
as 5 ns. These DSP-Sync FIFO memories feature read and write controls for use in applications such as  
DSP-to-processor communication, DSP-to-analog front end (AFE) buffering, network, video, and data  
communications.  
These are synchronous FIFOs, which means each port employs a synchronous interface. All data transfers  
through a port are gated to the low-to-high transition of a continuous (free-running) port clock by enable signals.  
The continuous clocks for each port are independent of one another and can be asynchronous or coincident.  
The enables for each port are arranged to provide a simple interface between DSPs, microprocessors, and/or  
buses controlled by a synchronous interface. An output-enable (OE) input controls the 3-state output.  
The synchronous FIFOs have two fixed flags, empty flag/output ready (EF/OR) and full flag/input ready (FF/IR),  
and two programmable flags, almost-empty (PAE) and almost-full (PAF). The offset loading of the  
programmable flags is controlled by a simple state machine, and is initiated by asserting the load pin (LD). A  
half-full flag (HF) is available when the FIFO is used in a single-device configuration.  
Two timing modes of operation are possible with these devices: first-word fall-through (FWFT) mode and  
standard mode.  
In FWFT mode, the first word written to an empty FIFO is clocked directly to the data output lines after three  
transitions of the RCLK signal. A read enable (REN) does not have to be asserted for accessing the first word.  
In standard mode, the first word written to an empty FIFO does not appear on the data output lines unless a  
specific read operation is performed. A read operation, which consists of activating REN and enabling a rising  
RCLK edge, shifts the word from internal memory to the data output lines.  
These devices are depth expandable, using a daisy-chain technique or FWFT mode. The XI and XO pins are  
used to expand the FIFOs. In depth-expansion configuration, first load (FL) is grounded on the first device and  
set to high for all other devices in the daisy chain.  
The SN74V215, SN74V225, SN74V235, and SN74V245 are characterized for operation from 0°C to 70°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
DSP-SYNC and TMS320 are trademarks of Texas Instruments.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...43

中文翻译

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SN74V225-20PAG 替代型号

型号 品牌 替代类型 描述 数据表
SN74V225-15PAG TI

类似代替

 512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES
72V225L15PFI IDT

功能相似

 TQFP-64, Tray

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SN74V235-10PAG TI

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SN74V235-15PAG TI

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SN74V235-20PAG TI

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SN74V235-7PAG TI

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 		512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES
SN74V245 TI

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 		512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES
SN74V245-10PAG TI

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 		512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES
SN74V245-15PAG TI

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 		512 X 18, 1024 X 18, 2048 X 18, 4096 X 18 DSP-SYNC FIRST-IN, FIRST-OUT MEMORIES
SN74V245-15PAGEP TI

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 		暂无描述

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