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SN74V263-EP PDF预览

SN74V263-EP

更新时间: 2024-01-22 07:28:41
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
49页 702K
描述
3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES

SN74V263-EP 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QFP
包装说明:TQFP-80针数:80
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.71Factory Lead Time:1 week
风险等级:0.8Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:4145
Samacsys Pin Count:80Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Quad Flat PackagesSamacsys Footprint Name:PZA (S-PQFP-G80)
Samacsys Released Date:2015-04-16 09:48:08Is Samacsys:N
最长访问时间:5 ns其他特性:CAN ALSO BE CONFIGURED AS 16384 X 9
备用内存宽度:9最大时钟频率 (fCLK):133 MHz
周期时间:7.5 nsJESD-30 代码:S-PQFP-G80
JESD-609代码:e4长度:14 mm
内存密度:147456 bit内存集成电路类型:OTHER FIFO
内存宽度:18湿度敏感等级:4
功能数量:1端子数量:80
字数:8192 words字数代码:8000
工作模式:SYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:8KX18
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP80,.64SQ封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.015 A子类别:FIFOs
最大压摆率:0.035 mA最大供电电压 (Vsup):3.45 V
最小供电电压 (Vsup):3.15 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

SN74V263-EP 数据手册

 浏览型号SN74V263-EP的Datasheet PDF文件第2页浏览型号SN74V263-EP的Datasheet PDF文件第3页浏览型号SN74V263-EP的Datasheet PDF文件第4页浏览型号SN74V263-EP的Datasheet PDF文件第5页浏览型号SN74V263-EP的Datasheet PDF文件第6页浏览型号SN74V263-EP的Datasheet PDF文件第7页 
SN74V263-EP, SN74V273-EP, SN74V283-EP, SN74V293-EP  
8192 × 18, 16384 × 18, 32768 × 18, 65536 × 18  
3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES  
SCAS695A – JUNE 2003 – REVISED JUNE 2003  
Controlled Baseline  
5-V-Tolerant Inputs  
– One Assembly/Test Site, One Fabrication  
Site  
Fixed, Low First-Word Latency  
Zero-Latency Retransmit  
Extended Temperature Performance of  
–55°C to 125°C  
Master Reset Clears Entire FIFO  
Partial Reset Clears Data, but Retains  
Programmable Settings  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
Empty, Full, and Half-Full Flags Signal FIFO  
Status  
Enhanced Product-Change Notification  
Qualification Pedigree  
Programmable Almost-Empty and  
Almost-Full Flags; Each Flag Can Default to  
One of Eight Preselected Offsets  
Choice of Memory Organizations  
– SN74V263 – 8192 × 18/16384 × 9  
– SN74V273 – 16384 × 18/32768 × 9  
– SN74V283 – 32768 × 18/65536 × 9  
– SN74V293 – 65536 × 18/131072 × 9  
Selectable Synchronous/Asynchronous  
Timing Modes for Almost-Empty and  
Almost-Full Flags  
133-MHz Operation  
Program Programmable Flags by Either  
Serial or Parallel Means  
7.5-ns Read/Write Cycle Time  
User-Selectable Input and Output Port Bus  
Sizing  
×9 in to ×9 out  
×9 in to ×18 out  
×18 in to ×9 out  
Select Standard Timing (Using EF and FF  
Flags) or First-Word Fall-Through (FWFT)  
Timing (Using OR and IR Flags)  
Output Enable Puts Data Outputs in  
High-Impedance State  
×18 in to ×18 out  
Easily Expandable in Depth and Width  
Big-Endian/Little-Endian User-Selectable  
Byte Representation  
Independent Read and Write Clocks Permit  
Reading and Writing Simultaneously  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
High-Performance Submicron CMOS  
Technology  
Glueless Interface With ’C6x DSPs  
Available in 80-Pin Thin Quad Flat Pack  
(TQFP) Package  
description/ordering information  
The SN74V263, SN74V273, SN74V283, and SN74V293 are exceptionally deep, high-speed, CMOS first-in  
first-out (FIFO) memories with clocked read and write controls and a flexible bus-matching ×9/×18 data flow.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
C
PACKAGE  
TQFP (PZA)  
TQFP (PZA)  
TQFP (PZA)  
TQFP (PZA)  
SN74V263PZAEP  
SN74V273PZAEP  
SN74V283PZAEP  
SN74V293PZAEP  
V263EP  
V273EP  
V283EP  
V293EP  
–55°C to 125°C  
Package drawings, standard packing quantities, thermal data, symbolization, and  
PCB design guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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SN74V273-15GGM TI

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8192 】 18, 16384 】 18, 32768 】 18, 65536 】 18
SN74V273-15PZA TI

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8192 】 18, 16384 】 18, 32768 】 18, 65536 】 18
SN74V273-6GGM TI

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SN74V273-7.5GGM TI

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SN74V273-7.5PZA TI

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16KX18 OTHER FIFO, 5ns, PQFP80, TQFP-80