Datasheet > SN74LVC3G34_15

SN74LVC3G34_15

更新时间： 2024-11-17 02:58:51

品牌	Logo	应用领域
德州仪器 - TI		栅
页数	文件大小	规格书
13页	526K
描述
Triple Buffer Gate

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SN74LVC3G34_15 数据手册

SN74LVC3G34

TRIPLE BUFFER GATE

www.ti.com

SCES366J–AUGUST 2001–REVISED FEBRUARY 2007

FEATURES

•

Available in the Texas Instruments

NanoFree™ Package

•

I_offSupports Partial-Power-Down Mode

Operation

•

Supports 5-V V_CCOperation

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

Inputs Accept Voltages to 5.5 V

Max t_pdof 4.1 ns at 3.3 V

ESD Protection Exceeds JESD 22

–

2000-V Human-Body Model (A114-A)

200-V Machine Model (A115-A)

Low Power Consumption, 10-µA Max I_CC

±24-mA Output Drive at 3.3 V

1000-V Charged-Device Model (C101)

Typical V_OLP(Output Ground Bounce)

<0.8 V at V_CC= 3.3 V, T_A= 25°C

•

Typical V_OHV(Output V_OHUndershoot)

>2 V at V_CC= 3.3 V, T_A= 25°C

DCT PACKAGE

(TOP VIEW)

DCU PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

4 5

GND

V_CC

3 6

2 7

1 8

V_CC

GND

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

This triple buffer gate is designed for 1.65-V to 5.5-V V_CCoperation. The SN74LVC3G34 performs the Boolean

function Y = A in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using I_off. The I_offcircuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC3G34YZPR

_ _ _C9_

C34_ _ _

Reel of 3000

Reel of 250

SN74LVC3G34DCTR

SN74LVC3G34DCUR

SN74LVC3G34DCUT

–40°C to 85°C

VSSOP – DCU

C34_

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...13

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