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SN74LVC3GU04 PDF预览

SN74LVC3GU04

更新时间: 2024-02-09 12:19:14
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德州仪器 - TI /
页数 文件大小 规格书
11页 251K
描述
TRIPLE INVERTER GATE

SN74LVC3GU04 数据手册

 浏览型号SN74LVC3GU04的Datasheet PDF文件第2页浏览型号SN74LVC3GU04的Datasheet PDF文件第3页浏览型号SN74LVC3GU04的Datasheet PDF文件第4页浏览型号SN74LVC3GU04的Datasheet PDF文件第5页浏览型号SN74LVC3GU04的Datasheet PDF文件第6页浏览型号SN74LVC3GU04的Datasheet PDF文件第7页 
SN74LVC3GU04  
TRIPLE INVERTER GATE  
www.ti.com  
SCES539AJANUARY 2004REVISED APRIL 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1A  
3Y  
2A  
V
CC  
1
2
3
4
8
7
6
5
Supports 5-V VCC Operation  
1Y  
3A  
2Y  
Inputs Accept Voltages to 5.5 V  
Max tpd of 3.9 ns at 3.3 V  
GND  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical VOLP (Output Ground Bounce)  
< 0.8 V at VCC = 3.3 V, TA = 25°C  
4
3
2
1
5
6
7
8
GND  
2A  
2Y  
3A  
1Y  
Typical VOHV (Output VOH Undershoot)  
> 2 V at VCC = 3.3 V, TA = 25°C  
3Y  
1A  
Unbuffered Outputs  
V
CC  
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This triple inverter is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC3GU04 contains three inverters with unbuffered outputs and performs the Boolean function Y = A.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC3GU04YEPR  
Reel of 3000  
_ _ _CD_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC3GU04YZPR  
–40°C to 85°C  
SSOP – DCT  
Reel of 3000 SN74LVC3GU04DCTR  
Reel of 3000 SN74LVC3GU04DCUR  
CU4_ _ _  
CU4_  
VSSOP – DCU  
Reel of 250  
SN74LVC3GU04DCUT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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