Datasheet > SN74LVC2G66_14

SN74LVC2G66_14

更新时间： 2024-02-12 20:08:37

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
19页	585K
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SN74LVC2G66 Dual Bilateral Analog Switch

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SN74LVC2G66_14 数据手册

SN74LVC2G66

DUAL BILATERAL ANALOG SWITCH

www.ti.com

SCES325J–JULY 2001–REVISED FEBRUARY 2007

FEATURES

•

Available in the Texas Instruments

NanoFree™ Package

•

High Speed, Typically 0.5 ns

(V_CC= 3 V, C_L= 50 pF)

•

1.65-V to 5.5-V V_CCOperation

Inputs Accept Voltages to 5.5 V

Max t_pdof 0.8 ns at 3.3 V

•

Rail-to-Rail Input/Output

Low On-State Resistance, Typically ≈6 Ω

(V_CC= 4.5 V)

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

High On-Off Output Voltage Ratio

High Degree of Linearity

DCT PACKAGE

(TOP VIEW)

DCU PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

4 5

GND

V_CC

3 6

2 7

1 8

V_CC

GND

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

This dual bilateral analog switch is designed for 1.65-V to 5.5-V V_CCoperation.

The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of

up to 5.5 V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the

associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING⁽²⁾

_ _ _C6_

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

Reel of 3000 SN74LVC2G66YZPR

SSOP – DCT

Reel of 3000 SN74LVC2G66DCTR

Reel of 3000 SN74LVC2G66DCUR

C66_ _ _

–40°C to 85°C

VSSOP – DCU

C66_

Reel of 250

SN74LVC2G66DCUT

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...19

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与SN74LVC2G66_14相关器件

型号	品牌	获取价格	描述	数据表
SN74LVC2G66DCTR	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCTRE4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCTRG4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCUR	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCURE4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCURG4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCUT	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCUTE4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCUTG4	TI	获取价格	DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66-Q1	TI	获取价格	DUAL BILATERAL ANALOG SWITCH

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