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SN74LVC2G66YZPR PDF预览

SN74LVC2G66YZPR

更新时间: 2024-11-18 22:11:51
品牌 Logo 应用领域
德州仪器 - TI 复用器开关复用器或开关信号电路
页数 文件大小 规格书
19页 428K
描述
DUAL BILATERAL ANALOG SWITCH

SN74LVC2G66YZPR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:VFBGA, BGA8,2X4,20针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.34Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:551775
Samacsys Pin Count:8Samacsys Part Category:Switch
Samacsys Package Category:BGASamacsys Footprint Name:YZP0008
Samacsys Released Date:2017-11-10 10:53:46Is Samacsys:N
模拟集成电路 - 其他类型:SPST标称带宽:300 MHz
最大输入电压:5.5 V最小输入电压:
JESD-30 代码:R-XBGA-B8JESD-609代码:e1
长度:1.9 mm湿度敏感等级:1
正常位置:NO信道数量:1
功能数量:2端子数量:8
标称断态隔离度:42 dB通态电阻匹配规范:5 Ω
最大通态电阻 (Ron):20 Ω最高工作温度:85 °C
最低工作温度:-40 °C输出:SEPARATE OUTPUT
封装主体材料:UNSPECIFIED封装代码:VFBGA
封装等效代码:BGA8,2X4,20封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:0.5 mm子类别:Multiplexers or Switches
最大供电电流 (Isup):0.015 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):2.3 V
表面贴装:YES最长断开时间:6.9 ns
最长接通时间:5.6 ns切换:MAKE-BEFORE-BREAK
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:0.9 mm
Base Number Matches:1

SN74LVC2G66YZPR 数据手册

 浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第2页浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第3页浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第4页浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第5页浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第6页浏览型号SN74LVC2G66YZPR的Datasheet PDF文件第7页 
SN74LVC2G66  
DUAL BILATERAL ANALOG SWITCH  
www.ti.com  
SCES325HJULY 2001REVISED JULY 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
4
8
7
6
5
1A  
1B  
2C  
V
CC  
1.65-V to 5.5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 0.8 ns at 3.3 V  
1C  
2B  
2A  
GND  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
High Speed, Typically 0.5 ns  
(VCC = 3 V, CL = 50 pF)  
4
3
2
1
5
6
7
8
GND  
2C  
2A  
2B  
1C  
Rail-to-Rail Input/Output  
Low On-State Resistance, Typically 6 Ω  
(VCC = 4.5 V)  
1B  
1A  
V
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
DESCRIPTION/ORDERING INFORMATION  
This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up  
to 5.5 V (peak) to be transmitted in either direction.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the  
associated switch section.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC2G66YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC2G66YZAR  
SN74LVC2G66YEPR  
SN74LVC2G66YZPR  
Reel of 3000  
_ _ _C6_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000 SN74LVC2G66DCTR  
Reel of 3000 SN74LVC2G66DCUR  
C66_ _ _  
C66_  
VSSOP – DCU  
Reel of 250  
SN74LVC2G66DCUT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

SN74LVC2G66YZPR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC2G66YZAR TI

完全替代

DUAL BILATERAL ANALOG SWITCH

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