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SN74LVC2G66DCUTE4

更新时间： 2024-11-18 22:11:51
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德州仪器 - TI 开关
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19页 428K
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DUAL BILATERAL ANALOG SWITCH

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SN74LVC2G66DCUTE4 数据手册

 浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第2页浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第3页浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第4页浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第5页浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第6页浏览型号SN74LVC2G66DCUTE4的Datasheet PDF文件第7页 
SN74LVC2G66  
DUAL BILATERAL ANALOG SWITCH  
www.ti.com  
SCES325H–JULY 2001–REVISED JULY 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
4
8
7
6
5
1A  
1B  
2C  
V
CC  
•
•
•
•
•
•
1.65-V to 5.5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 0.8 ns at 3.3 V  
1C  
2B  
2A  
GND  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
High Speed, Typically 0.5 ns  
(VCC = 3 V, CL = 50 pF)  
4
3
2
1
5
6
7
8
GND  
2C  
2A  
2B  
1C  
•
•
Rail-to-Rail Input/Output  
Low On-State Resistance, Typically ≈6 Ω  
(VCC = 4.5 V)  
1B  
1A  
V
CC  
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
DESCRIPTION/ORDERING INFORMATION  
This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up  
to 5.5 V (peak) to be transmitted in either direction.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the  
associated switch section.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC2G66YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC2G66YZAR  
SN74LVC2G66YEPR  
SN74LVC2G66YZPR  
Reel of 3000  
_ _ _C6_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000 SN74LVC2G66DCTR  
Reel of 3000 SN74LVC2G66DCUR  
C66_ _ _  
C66_  
VSSOP – DCU  
Reel of 250  
SN74LVC2G66DCUT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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SN74LVC2G66DCUTE4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC2G66DCUT TI

完全替代

 DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCURE4 TI

完全替代

 DUAL BILATERAL ANALOG SWITCH
SN74LVC2G66DCUR TI

完全替代

 DUAL BILATERAL ANALOG SWITCH

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