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SN74LVC1G97DCK3 PDF预览

SN74LVC1G97DCK3

更新时间： 2024-11-05 11:07:59
品牌 Logo 应用领域
德州仪器 - TI 逻辑集成电路
页数 文件大小 规格书
17页 516K
描述
可配置多功能门 | DCK | 6 | -40 to 125

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SN74LVC1G97DCK3 数据手册

 浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第2页浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第3页浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第4页浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第5页浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第6页浏览型号SN74LVC1G97DCK3的Datasheet PDF文件第7页 
SN74LVC1G97  
CONFIGURABLE MULTIPLE-FUNCTION GATE  
www.ti.com  
SCES416I–DECEMBER 2002–REVISED MARCH 2006  
FEATURES  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
•
•
•
•
Supports 5-V VCC Operation  
ESD Protection Exceeds JESD 22  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6.3 ns at 3.3 V  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
– 1000-V Charged-Device Model (C101)  
Choose From Nine Specific Logic Functions  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
YEA, YEP, YZA,  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
OR YZP PACKAGE  
(BOTTOM VIEW)  
3
4
Y
V
In0  
GND  
In1  
1
2
3
6
5
4
In1  
GND  
In0  
In2  
In1  
GND  
In0  
In2  
1
2
3
6
5
4
1
2
3
6
In1  
GND  
In0  
In2  
V
2 5  
CC  
V
Y
CC  
V
Y
CC  
1
6
In2  
5
4
CC  
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G97 features configurable multiple functions. The output state is determined by eight patterns of  
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All  
inputs can be connected to VCC or GND.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC1G97YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC1G97YZAR  
_ _ _CS_  
Tape and reel  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1G97YEPR  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC1G97YZPR  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
SOT (SOT-563) – DRL  
Tape and reel  
Tape and reel  
Reel of 4000  
SN74LVC1G97DBVR  
SN74LVC1G97DCKR  
SN74LVC1G97DRLR  
C97_  
CS_  
CS_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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